AD9235-20PCB Analog Devices Inc, AD9235-20PCB Datasheet - Page 5

• Manufacturer Part Number: AD9235-20PCB
• Description: BOARD EVAL FOR AD9235-20
• Manufacturer: Analog Devices Inc

Specifications of AD9235-20PCB

• Rohs Status: RoHS non-compliant
• Number Of Adc's: 1
• Number Of Bits: 12
• Sampling Rate (per Second): 20M
• Data Interface: Parallel
• Inputs Per Adc: 1 Differential
• Input Range: 2 Vpp
• Power (typ) @ Conditions: 95mW @ 20MSPS
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9235-20
• Lead Free Status / Rohs Status: Not Compliant

ABSOLUTE MAXIMUM RATINGS
Pin Name
ELECTRICAL
ENVIRONMENTAL
NOTES
1
2
Model
AD9235BRU-20
AD9235BRU-40
AD9235BRU-65
AD9235BCP-20*
AD9235BCP-40*
AD9235BCP-65*
AD9235-20PCB
AD9235-40PCB
AD9235-65PCB
AD9235BCP-20EB
AD9235BCP-40EB
AD9235BCP-65EB
*It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of
REV. B
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD9235 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Absolute maximum ratings are limiting values to be applied individually and
Typical thermal impedances (28-lead TSSOP), θ
the package is achieved with exposed paddle soldered to the customer board.
beyond which the serviceability of the circuit may be impaired. Functional
operability is not necessarily implied. Exposure to absolute maximum rating
conditions for an extended period of time may affect device reliability.
θ
board in still air, in accordance with EIA/JESD51-1.
JA
AVDD
DRVDD
AGND
AVDD
Digital Outputs
CLK, MODE
VIN+, VIN–
VREF
SENSE
REFB, REFT
PDWN
Operating Temperature
Junction Temperature
Lead Temperature (10 sec)
Storage Temperature
= 32.5°C/W, θ
JC
= 32.71°C/W. These measurements were taken on a 4-layer
With
Respect to Min Max
AGND
DGND
DGND
DRVDD
DGND
AGND
AGND
AGND
AGND
AGND
AGND
Temperature Range Package Description
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
2
–0.3
–0.3
–0.3
–3.9
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–40
–65
1
JA
= 67.7°C/W; (32-lead LFCSP),
+3.9
+3.9
+0.3
+3.9
DRVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
+85
150
300
+150
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
32-Lead Lead Frame Chip Scale Package (LFCSP) (Contact Factory) CP-32
32-Lead Lead Frame Chip Scale Package (LFCSP) (Contact Factory) CP-32
32-Lead Lead Frame Chip Scale Package (LFCSP)
TSSOP Evaluation Board
TSSOP Evaluation Board
TSSOP Evaluation Board
LFCSP Evaluation Board (Contact Factory)
LFCSP Evaluation Board (Contact Factory)
LFCSP Evaluation Board
ORDERING GUIDE
Unit
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
°C
–5–
EXPLANATION OF TEST LEVELS
I
II 100% production tested at 25°C and sample tested at
III Sample tested only.
IV Parameter is guaranteed by design and characterization testing.
V Parameter is a typical value only.
VI 100% production tested at 25°C; guaranteed by design and
100% production tested.
specified temperatures.
characterization testing for industrial temperature range;
100% production tested at temperature extremes for military
devices.
WARNING!
ESD SENSITIVE DEVICE
Package Option
RU-28
RU-28
RU-28
CP-32
AD9235