74HC1G66GW NXP Semiconductors, 74HC1G66GW Datasheet

IC, 74HC SINGLE GATE, SMD, 74HC1G66

74HC1G66GW

Manufacturer Part Number
74HC1G66GW
Description
IC, 74HC SINGLE GATE, SMD, 74HC1G66
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74HC1G66GW

Analogue Switch Type
Bilateral Switch
No. Of Channels
1
Turn Off Time
11ns
Turn On Time
11ns
Supply Voltage Range
2V To 10V
Operating Temperature Range
-40°C To +125°C
Analogue Switch Case
RoHS Compliant
On State Resistance Max
105ohm
Rohs Compliant
Yes

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74HC1G66GW
Manufacturer:
NXP
Quantity:
36 000
Part Number:
74HC1G66GW
Manufacturer:
NXP
Quantity:
6 000
Part Number:
74HC1G66GW
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Product specification
Supersedes data of 2001 Mar 02
DATA SHEET
74HC1G66; 74HCT1G66
Bilateral switch
INTEGRATED CIRCUITS
2002 May 15

Related parts for 74HC1G66GW

74HC1G66GW Summary of contents

Page 1

DATA SHEET 74HC1G66; 74HCT1G66 Bilateral switch Product specification Supersedes data of 2001 Mar 02 INTEGRATED CIRCUITS 2002 May 15 ...

Page 2

Philips Semiconductors Bilateral switch FEATURES Wide operating voltage range from 2.0 to 9.0 V Very low ON-resistance: – 45 (typical 4 – 30 (typical 6 – 25 (typical ...

Page 3

... Philips Semiconductors Bilateral switch ORDERING INFORMATION OUTSIDE NORTH TEMPERATURE AMERICA RANGE 74HC1G66GW 40 to +125 C 74HCT1G66GW 40 to +125 C 74HC1G66GV 40 to +125 C 74HCT1G66GV 40 to +125 C PINNING PIN SYMBOL GND handbook, halfpage GND MNA074 Fig.1 Pin configuration. 1 handbook, halfpage MNA076 Fig.3 IEC logic symbol. ...

Page 4

Philips Semiconductors Bilateral switch RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER V supply voltage CC V input voltage I V switch voltage S T operating ambient amb temperature input rise and fall times r f LIMITING VALUES In accordance ...

Page 5

Philips Semiconductors Bilateral switch DC CHARACTERISTICS Family 74HC1G66 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER V HIGH-level input IH voltage V LOW-level input IL voltage I input leakage LI current I analog ...

Page 6

Philips Semiconductors Bilateral switch Family 74HCT1G66 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER V HIGH-level input IH voltage LOW-level input voltage input leakage current LI I analog switch current, ...

Page 7

Philips Semiconductors Bilateral switch Family 74HC1G66 and 74HCT1G66 For 74HC1G66 2.0, 4.5, 6.0 or 9.0 V; note 1. CC For 74HCT1G66 4 SYMBOL PARAMETER R ON-resistance (peak see Fig.5 ...

Page 8

Philips Semiconductors Bilateral switch HIGH (from enable inputs GND Fig.5 Test circuit for measuring ON-resistance ( HIGH (from enable input GND ...

Page 9

Philips Semiconductors Bilateral switch AC CHARACTERISTICS Type 74HC1G66 GND = ns SYMBOL PARAMETER t /t propagation delay PHL PLH turn-on time PZH PZL E ...

Page 10

Philips Semiconductors Bilateral switch Type 74HC1G66 and 74HCT1G66 At recommended conditions and typical values. GND = whichever is assigned as an input; V SYMBOL PARAMETER sine-wave distortion kHz sine-wave distortion kHz ...

Page 11

Philips Semiconductors Bilateral switch 0 handbook, full pagewidth (dB 100 Test conditions 4.5 V; GND = Fig.9 Typical switch OFF signal feed-through as a function of frequency. ...

Page 12

Philips Semiconductors Bilateral switch handbook, full pagewidth sine-wave Adjust input voltage to obtain 0 dBm at V After set-up, frequency increased to obtain a reading Fig.11 Test circuit for measuring minimum ...

Page 13

Philips Semiconductors Bilateral switch AC WAVEFORMS V I handbook, halfpage ( GND t PLH ( ( ( (1) For HC1G V = 50% M For HCT1G V = ...

Page 14

Philips Semiconductors Bilateral switch PACKAGE OUTLINES Plastic surface mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT max 0.30 0.25 1.1 mm 0.1 0.8 0.20 0.10 OUTLINE ...

Page 15

Philips Semiconductors Bilateral switch Plastic surface mounted package; 5 leads DIMENSIONS (mm are the original dimensions) UNIT 0.100 0.40 0.26 1.1 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC ...

Page 16

Philips Semiconductors Bilateral switch SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” ...

Page 17

Philips Semiconductors Bilateral switch Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS (4) PLCC , SO, SOJ LQFP, QFP, ...

Page 18

Philips Semiconductors Bilateral switch DATA SHEET STATUS PRODUCT (1) DATA SHEET STATUS STATUS Objective data Development Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The ...

Page 19

Philips Semiconductors Bilateral switch 2002 May 15 74HC1G66; 74HCT1G66 NOTES 19 Product specification ...

Page 20

Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited ...

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