PIC12CE674-04E/P Microchip Technology, PIC12CE674-04E/P Datasheet - Page 21
![IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,8PIN,PLASTIC](/photos/16/0/160065/8-pdip-angled-300dpi-lyrd_sml.jpg)
PIC12CE674-04E/P
Manufacturer Part Number
PIC12CE674-04E/P
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,8PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(3 pages)
4.PIC12CE673-10P.pdf
(14 pages)
5.PIC12CE673-10P.pdf
(12 pages)
Specifications of PIC12CE674-04E/P
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Eeprom Size
16 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DIP (0.300", 7.62mm)
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12CE674-04E/P
Manufacturer:
MICROCHIP
Quantity:
12 000
- PIC16F688T-ISL PDF datasheet
- PIC12CE673-10P PDF datasheet #2
- PIC12CE673-10P PDF datasheet #3
- PIC12CE673-10P PDF datasheet #4
- PIC12CE673-10P PDF datasheet #5
- Current page: 21 of 688
- Download datasheet (3Mb)
1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1
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