NTE425 NTE ELECTRONICS, NTE425 Datasheet

NTE425

Manufacturer Part Number

NTE425

Description

THERMAL INTERFACE PAD

Manufacturer

NTE ELECTRONICS

Datasheet

1.NTE425.pdf (2 pages)

Specifications of NTE425

Product

Unspecified Hardware

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

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Description:

The NTE425 is designed as a pressure sensitive, thermal interface material for use between a high

performance processor and a heat sink. NTE425 is a thermally conductive, inherently tacky, +55 C

phase change composite supplied on a polyester carrier liner with high visibility protective tabs.

Features:

D Thermal Impedance: 0.08 C−in

D Inherently Tacky, +55 C Phase Change Composite

D High Visibility Protective Tabs

D Pressure Sensitive Phase Change Thermal Interface Material

Typical Applications:

D Computer and Peripherals

D High Performance Computer Processors

D Graphic Cords

D Power Modules

Typical Properties:

Note 1. The ASTM D5470 (Modified) test fixture was used with the material sample conditioned at +60 C prior to test. The

Note 2. This is a measured thermal conductivity of the coating. Since the coating is a phase change compound, it will re-

Physical Property

Color

Reinforcement Carrier

Thickness

Continuous Use Temperature

Phase Change Temperature

Electrical

Flame Rating

Thermal

Thermal Conductivity (Note 2)

Thermal Impedance vs. Pressure

Pressure, psi

TO220 Thermal Performance

Thermal Impedance (Note 1)

recorded value includes interfacial thermal resistance. These values are given to the customer for reference

only. Actual application thermal performance is primarily controlled via surface “wet−out” and material “bond−

line” or thickness. Within the application, these are directly related to surface roughness, flatness and pressure

applied.

spond to heat and pressure induced stresses. The overall thermal conductivity of post−phase change material

is highly dependent upon the heat and pressure applied. These characteristics are not accounted for in ASTM

D5470.

Self−Adhesive, 1.65” x 1.65”

Typical Value

0.7W/m−K

94 V−O

+248 F

+131 F

Thermal Interface Pad

0.003”

Black

None

0.09 C−in

0.60 C/W

/W (@ 25psi)

NTE425

0.08 C−in

0.53 C/W

Metric Value

0.7W/m−K

0.077mm

+120 C

94 V−O

+55 C

Black

None

0.07 C−in

0.46 C/W

0.06 C−in

0.40 C/W

100

ASTM D5470

Test Method

ASTM D374

Visual

DSC

U.L.

***

0.05 C−in

0.35 C/W

200

Related parts for NTE425

NTE425 Summary of contents

Page 1

... Description: The NTE425 is designed as a pressure sensitive, thermal interface material for use between a high performance processor and a heat sink. NTE425 is a thermally conductive, inherently tacky, +55 C phase change composite supplied on a polyester carrier liner with high visibility protective tabs. Features: D Thermal Impedance: 0.08 C−in ...

Page 2

... Continue to use a wiping action to ensure full “wet−out” of the NTE425 pad to the interface of the heat sink. Step 6: Peel away protective liner from thermal pad and re−install heat sink being careful not to damage or contaminate thermal pad ...

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