NTE425 NTE ELECTRONICS, NTE425 Datasheet - Page 2

• Manufacturer Part Number: NTE425
• Description: THERMAL INTERFACE PAD
• Manufacturer: NTE ELECTRONICS

Specifications of NTE425

• Product: Unspecified Hardware
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Application Methods:
Hand−apply the NTE425 to a room temperature heat sink. The NTE425 pad exhibits inherent tack
and can be hand−applied similar to an adhesive pad. The tab liner can remain on the heat sink and
pad throughout shipping and handling until it is ready for final assembly.
Installation Instructions:
Step 1: Prepare heat sink for removal.
Step 2: Remove old thermal material via repeated scraping action with a plastic or wooden device.
Step 3: With most of the old material removed, begin to clean the remaining residue and heat sink
Step 4: Once the cleaning solvent has dried, the new heat sink interface pad is ready for application.
Step 5: Apply the NTE425 by placing the material to the heat sink interface. Using finger pressure,
Step 6: Peel away protective liner from thermal pad and re−install heat sink being careful not to damage
Special Guidelines:
Pay special attention to the following guidlines while installing a processor:
Caution: The processor may be destroyed if all of these guidelines are not followed.
D Never operate the processor without having an approved heat sink fully and properly attached with
D Make sure the heat sink used has been tested for the speed rating of the processor used.
D Never run a processor at megahertz speeds greater than the rated megahertz speed.
D Always use an appropriate amount of thermal phase−change compound (Note 3).
D Never power up the board with the processor heat sink fans unplugged.
D Plug the fans into the fan header connector on the motherboard or power supply as specified by
D If the heat sink needs to be removed from the processor, the old phase−change material must be
Note 3. For production builds, thermal grease is never an appropriate solution. Thermal grease can be used for short−
Note 4. Only use a soft plastic scraper to gently remove the old phase−change material from the heat sink and/or the processor.
the appropriate thermal interface. In order to function, the heat sink must be attached to the socket
with the supplied clip.
the motherboard manual.
completely removed from the heat sink and processor. Then, new material (NTE425) must be
installed (Note 4).
term testing and validation. When used for a longer period, thermal grease has a tendency to be pumped out from
the gap between the processor and the heat sink due to the differing thermal expansion and contraction rates of
the aluminum heat sink and the processor.
This device can be used to peel the material away without scratching the heat sink surface.
surface with Isopropyl Alcohol. Use a cotton swab or lint free wipe to clean the heat sink sur-
face to a polished shine.
wipe from corner to corner to minimize entrapment of air at the interface. Continue to use
a wiping action to ensure full “wet−out” of the NTE425 pad to the interface of the heat sink.
or contaminate thermal pad.
Clear Polyester
Carrier Liner
Protective Tab
Clear/Colored
“Quick−Snap” High Visibility
Adhesive
Tab fo Removal
Strip