HSDL-3210-021 Avago Technologies US Inc., HSDL-3210-021 Datasheet - Page 10

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HSDL-3210-021

Manufacturer Part Number
HSDL-3210-021
Description
Infrared Transceivers 20-30cm MIR
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HSDL-3210-021

Wavelength
875 nm, 880 nm
Continual Data Transmission
1.152 Mbit/s
Transmission Distance
20 cm
Radiant Intensity
30 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Pulse Width
7.5 us, 1.6 us
Maximum Rise Time
100 ns, 600 ns
Maximum Fall Time
100 ns, 600 ns
Led Supply Voltage
0 V to 6.5 V
Operating Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Dimensions
8 mm x 3 mm x 2.5 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Moisture-Proof Packaging
All HSDL-3210 options are shipped in moisture-proof packaging. Once opened, moisture absorption begins.
This product is compliant to JEDEC level 4.
Figure 11. Baking conditions chart.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Packaging
In Reels
In Bulk
Baking should only be done once.
1 0
PERFORM RECOMMENDED
Temp.
60˚C
100˚C
125˚C
150˚C
OPENED (UNSEALED)
BAKING CONDITIONS
UNITS IN A SEALED
MOISTURE-PROOF
THAN 72 HOURS?
LESS THAN 25°C,
AND LESS THAN
OPENED MORE
ENVIRONMENT
PACKAGE IS
PACKAGE IS
PACKAGE
60% RH?
YES
NO
Time
48 hours
4 hours
2 hours
1 hour
YES
NO
Recommended Storage Conditions
Storage Temp.
Relative Humidity
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than three days are
needed, the parts must be stored
in a dry box.
IS NECESSARY
NO BAKING
10˚C to 30˚C
Below 60% RH

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