HSDL-3210-021 Avago Technologies US Inc., HSDL-3210-021 Datasheet - Page 13

• Manufacturer Part Number: HSDL-3210-021
• Description: Infrared Transceivers 20-30cm MIR
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-3210-021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 1.152 Mbit/s
• Transmission Distance: 20 cm
• Radiant Intensity: 30 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 7.5 us, 1.6 us
• Maximum Rise Time: 100 ns, 600 ns
• Maximum Fall Time: 100 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Operating Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1 3
1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure ad-
equate printed solder paste vol-
ume and no shorting. See the
table below the drawing for com-
binations of metal stencil aper-
ture and metal stencil thickness
that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
Stencil Thickness, t (mm)
0.152 mm
0.127 mm
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land pat-
tern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm. It is recommended that
two fiducial crosses be placed at
mid-length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Aperture Size (mm)
Length, l
2.60 0.05
3.00 0.05
Figure 15. Solder stencil aperture.
Figure 16. Adjacent land keep-out and solder mask areas.
l
APERTURES AS PER
LAND DIMENSIONS
SOLDER MASK
0.2
Width, w
0.55 0.05
0.55 0.05
8.2
w
UNITS: mm
t
3.1
3.0