HSEC8-150-01-S-DV-A-BL Samtec Inc, HSEC8-150-01-S-DV-A-BL Datasheet

HSEC8-150-01-S-DV-A-BL

Manufacturer Part Number

HSEC8-150-01-S-DV-A-BL

Description

Manufacturer

Samtec Inc

Type

Card Edger

Datasheet

1.HSEC8-150-01-S-DV-A-BL.pdf (1 pages)

Specifications of HSEC8-150-01-S-DV-A-BL

Number Of Contacts

100POS

Number Of Contact Rows

Body Orientation

Straight

Card Thickness (mm)

1.6mm

Contact Plating

Gold Over Nickel

Contact Material

Beryllium Copper

Termination Method

Solder

Mounting Style

Surface Mount

Operating Temp Range

-55C to 125C

Pitch (mm)

0.8mm

Housing Material

Liquid Cryst Polymer

Housing Color

Black

Current Rating (max)

3.1A

Lead Free Status / RoHS Status

Compliant

Current page: 1 of 1
Download datasheet (598Kb)

VERTICAL EDGE RATE

For complete speciﬁ cations and

recommended PCB layouts see

www.samtec.com?HSEC8-DV

Insulator Material:

Black Liquid

Crystal Polymer

Contact:

BeCu

Plating:

Au or Sn over 50µ"

(1,27µm) Ni

Current Rating:

3.1A @ 30°C Temperature Rise

(See website for details)

Operating Temp:

-55°C to +125°C

Card Insertion Depth:

(3,15mm) .125" nominal

RoHS Compliant:

Yes

Processing:

Lead–Free Solderable:

Yes

SMT Lead Coplanarity:

(0,10mm) .004" max (10-60)

Note: Some lengths, styles

and options are non-standard,

non-returnable.

F-210-2

SPECIFIC OPTION

• Samtec supplied card

• Specialty

• Custom cards for low-cost

SPECIFICATIONS

• Standard high speed

HSEC8-DV SERIES

CUSTOM CARDS

(0,80mm) .0315"

layout/artwork to make

your own

cards

card

shapes

interface cards for 19mm,

25mm & 30mm mated

heights, single-ended &

differential applications.

See HSC8 Series.

stack height customization

pass-through options.

APPLICATION

STANDARD &

AVAILABLE

Guide rails and

Call Samtec.

Mates with:

1,60mm thick cards,

ECDP, HSC8, HSF8

HSEC8

0,80mm HSEC8

7,98mm Stack Height

Single-Ended Signaling

Differential Pair Signaling

For complete test data go to www.samtec.com?HSEC8-DV

or contact sig@samtec.com

(7,80)

.307

(1,32)

.052

10, 13, 20, 25, 30, 37,

No. of Positions x (0,80) .0315 + (7,80) .307

40, 49, 50, 60

(0,80) .0315 + (4,60) .181

(0,80) .0315 + (2,20) .087

No. of Positions x

THICKNESS

10, 20 & 30

CARD

–01

–03

POSITIONS

Rated @ 3dB Insertion Loss

(1,12) .044 DIA

PER ROW

(0,80) .0315

10.5 GHz / 21 Gbps

8 GHz / 16 Gbps

WWW.SAMTEC.COM

(1,75) .070 (5,60) .220 (7,00) .276

(2,54) .100 (6,39) .252 (7,79) .307

™

HSEC8–149–01–L–DV–A

™

(7,98)

.314

B C

THICKNESS

CARD SOCKET

= (1,60mm) .062"

= (2,36mm) .093"

thick card

CARD

–01

–03

(7,98)

.314

(4,25)

POSITIONS

Positions where no dimensions are given

do not have keying feature.

*Mates with ECDP Series.

.167

PER ROW

13*

25*

37*

49*

Note: Other Gold plating

options available.

Contact Samtec.

PLATING

OPTION

–BL

Alignment

Pins

(26,90) 1.059 (52,60) 2.071

(18,10) .713 (34,20) 1.346

(18,90) .744 (36,60) 1.441

(22,90) .902 (43,80) 1.724

(22,90) .902 (44,60) 1.756

(6,10) .240

Gold on contact,

= 10µ" (0,25µm)

Matte Tin on tail

–L

HSEC8–125–01–L–DV–A

(15,00) .591

(24,60) .969

HIGH SPEED CABLE &

–EM to –DV

FLEX APPLICATIONS

BOARD-TO-BOARD

–L1

APPLICATIONS

–DV to HSF8

–DV to ECDP

CONNECTOR CABLE*

–DV to –DV

HSEC8–113

HSEC8–125

HSEC8–137

HSEC8–149

= (5,50mm) .217" DIA

(Other sizes available.

(For use with ECDP.)

• Board lock option

• Latch option

(13, 25, 37, 49 only)

= Latching Option

Pick & Place Pad

Contact Samtec.)

Polyimide Film

(40, 50, 60 only)

= Board Locks

= Tape & Reel

Packaging

= Weld tab

–WT

–TR

–BL

–L1

–K

OPTION

OTHER

PCB to –DV

ECDP–08

ECDP–16

ECDP–24

ECDP–32

Related parts for HSEC8-150-01-S-DV-A-BL

Related keywords

HSEC8-150-01-S-DV-A-BL datasheet
HSEC8-150-01-S-DV-A-BL data sheet
HSEC8-150-01-S-DV-A-BL pdf datasheet
HSEC8-150-01-S-DV-A-BL component
HSEC8-150-01-S-DV-A-BL part
HSEC8-150-01-S-DV-A-BL distributor
HSEC8-150-01-S-DV-A-BL RoHS
HSEC8-150-01-S-DV-A-BL datasheet download