HSEC8-150-01-H-DV-A-K-TR Samtec Inc, HSEC8-150-01-H-DV-A-K-TR Datasheet

HSEC8-150-01-H-DV-A-K-TR

Manufacturer Part Number

HSEC8-150-01-H-DV-A-K-TR

Description

Manufacturer

Samtec Inc

Type

Card Edger

Datasheet

1.HSEC8-150-01-H-DV-A-K-TR.pdf (1 pages)

Specifications of HSEC8-150-01-H-DV-A-K-TR

Number Of Contacts

100POS

Number Of Contact Rows

Body Orientation

Straight

Card Thickness (mm)

1.6mm

Contact Plating

Gold Over Nickel

Contact Material

Beryllium Copper

Termination Method

Solder

Mounting Style

Surface Mount

Product Height (mm)

7.98mm

Operating Temp Range

-55C to 125C

Pitch (mm)

0.8mm

Housing Material

Liquid Cryst Polymer

Housing Color

Black

Current Rating (max)

3.1A

Lead Free Status / RoHS Status

Compliant

Current page: 1 of 1
Download datasheet (599Kb)

0,80

For complete speciﬁ cations and

recommended PCB layouts see

www.samtec.com?HSEC8-DV

Insulator Material:

Black Liquid

Crystal Polymer

Contact: BeCu

Plating:

Au or Sn over 50µ"

(1,27µm) Ni

Current Rating:

3.1A @ 30°C Temperature Rise

Operating Temp:

-55°C to +125°C

Card Insertion Depth:

(3,15mm) .125" nominal

RoHS Compliant: Yes

Processing:

Max Processing Temp:

230°C for 60 seconds, or

260°C for 20 seconds 3x

Lead–Free Solderable: Yes

SMT Lead Coplanarity:

(0,10mm) .004" max (10-60)

Note: Other Gold plating

options available.

Contact Samtec.

Note: Some lengths, styles

and options are non-standard,

non-returnable.

F-209-2

SPECIFIC OPTION

• Custom cards for low-cost

• Samtec supplied card

• Specialty

SPECIFICATIONS

• Standard high speed

CUSTOM CARDS

interface cards for 19mm,

25mm & 30mm mated

heights, single-ended &

differential applications.

See HSC8 Series.

stack height customization

layout/artwork to make

your own

cards

card

shapes

APPLICATION

STANDARD &

AVAILABLE

Guide Rails.

Call Samtec.

Mates with:

1,6mm thick cards,

EEDP, HSC8, HSF8

HI-SPEED SOCKET

HSEC8

0,80mm HSEC8

7,98mm Stack Height

Single-Ended Signaling

Differential Pair Signaling

For complete test data go to www.samtec.com?HSEC8

or contact sig@samtec.com

(7,80)

.307

(1,75)

(1,50)

.069

.059

10, 13, 20, 25, 30, 37,

No. of Positions x (0,80) .0315 + (4,60) .181

No. of Positions x (0,80) .0315 + (7,80) .307

40, 49, 50, 60

(0,80) .0315 + (2,20) .087

No. of Positions x

10, 20 & 30

POSITIONS

Rated @ -3dB Insertion Loss

PER ROW

(1,12) .044 DIA

(0,80) .0315

10.5 GHz / 21 Gbps

8 GHz / 16 Gbps

WWW.SAMTEC.COM

™

HSEC8–160–01–S–DV–A

(7,98)

(5,60)

.314

.220

THICKNESS

= (1,60mm) .062"

thick card

CARD

(7,00)

.276

–01

(7,98)

POSITIONS

.314

(4,22)

PER ROW

.166

Mates with EEDP Series.

Positions where no dimensions are given

do not have keying feature.

13*

25*

37*

49*

PLATING

OPTION

= 30µ" (0,76µm) Gold on contact,

(26,90) 1.059

(18,10) .713

(18,90) .744

(22,90) .902

Alignment

Pins

(6,10) .240

–BL

Matte Tin on tail

–S

(34,20) 1.346

(36,60) 1.441

(43,80) 1.724

(44,60) 1.756

(52,60) 2.071

(15,00) .591

(24,60) .969

HSEC8–130–01–S–DV–A

HIGH SPEED CABLE &

–EM to –DV

FLEX APPLICATIONS

HSEC8

SERIES

BOARD-TO-BOARD

APPLICATIONS

–DV to HSF8

–L

CONNECTOR CABLE*

–DV to EEDP

HSEC8–113

HSEC8–125

HSEC8–137

HSEC8–149

–DV to –DV

with EEDP.)

OPTION

= (5,50mm)

OTHER

Packaging

= Latching

(13, 25, 37,

Place Pad

Polyimide

PCB to –DV

.217" DIA

= Tape &

(For use

49 only)

60 only)

= Board

EEDP–08

EEDP–16

EEDP–24

EEDP–32

–TR

Option

–BL

(40, 50,

Pick &

Locks

–K

Reel

Film

–L

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