EFM32-TG840F32-SK Energy Micro, EFM32-TG840F32-SK Datasheet - Page 56

• Manufacturer Part Number: EFM32-TG840F32-SK
• Description: MCU, MPU & DSP Development Tools TG840 Sample Kit
• Manufacturer: Energy Micro

Specifications of EFM32-TG840F32-SK

• Processor To Be Evaluated: EFM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

5.2 Soldering Information
2012-02-27 - EFM32TG840FXX - d0011_Rev0.95
Figure 5.3. QFN64 PCB Stencil Design
Table 5.3. QFN64 PCB Stencil Design Dimensions (Dimensions in mm)
1. The drawings are not to scale.
2. All dimensions are in millimeters.
3. All drawings are subject to change without notice.
4. The PCB Land Pattern drawing is in compliance with IPC-7351B.
5. Stencil thickness 0.125 mm.
The latest IPC/JEDEC J-STD-020 recommendations for Pb-Free reflow soldering should be followed.
The packages have a Moisture Sensitivity Level rating of 3, please see the latest IPC/JEDEC J-STD-033
standard for MSL description and level 3 bake conditions.
Symbol
a
b
c
d
b
c
Dim. (mm)
a
0.85
0.30
0.50
8.90
x
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d
z
y
Symbol
e
x
y
z
www.energymicro.com
e
Dim. (mm)
8.90
2.70
2.70
0.80