AM29F160DB-90EI Spansion Inc., AM29F160DB-90EI Datasheet - Page 5

• Manufacturer Part Number: AM29F160DB-90EI
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29F160DB-90EI

• Memory Size: 16Mbit
• Memory Configuration: 2M X 8 / 1M X 16
• Ic Interface Type: Parallel
• Access Time: 90ns
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Termination Type: SMD
• Memory Voltage, Vcc: 5V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 8
Common Flash Memory Interface (CFI) . . . . . . . 15
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 18
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 23
Word/Byte Configuration .......................................................... 8
Requirements for Reading Array Data ..................................... 8
Writing Commands/Command Sequences .............................. 9
Program and Erase Operation Status ...................................... 9
Standby Mode .......................................................................... 9
Automatic Sleep Mode ............................................................. 9
RESET#: Hardware Reset Pin ................................................. 9
Output Disable Mode................................................................ 9
Autoselect Mode..................................................................... 12
Sector Protection/Unprotection............................................... 12
Write Protect (WP#)................................................................ 13
Temporary Sector Unprotect .................................................. 13
Hardware Data Protection ...................................................... 18
Reading Array Data ................................................................ 18
Reset Command..................................................................... 18
Autoselect Command Sequence ............................................ 19
Word/Byte Program Command Sequence ............................. 19
Chip Erase Command Sequence ........................................... 20
Sector Erase Command Sequence ........................................ 20
Erase Suspend/Erase Resume Commands........................... 21
Command Definitions ............................................................. 22
DQ7: Data# Polling................................................................. 23
Table 1. Am29F160D Device Bus Operations .................................. 8
Table 2. Am29F160DT Sector Address Table (Top Boot) .............. 10
Table 3. Am29F160DB Sector Address Table (Bottom Boot)......... 11
Table 4. Am29F160D Autoselect Codes (High Voltage Method).... 12
Figure 1. Temporary Sector Unprotect Operation........................... 13
Table 5. CFI Query Identification String .......................................... 15
Table 6. System Interface String..................................................... 16
Table 7. Device Geometry Definition .............................................. 16
Table 8. Primary Vendor-Specific Extended Query ........................ 17
Low V
Write Pulse “Glitch” Protection ........................................................ 18
Logical Inhibit .................................................................................. 18
Power-Up Write Inhibit .................................................................... 18
Unlock Bypass Command Sequence.............................................. 19
Figure 3. Program Operation .......................................................... 20
Figure 4. Erase Operation............................................................... 21
Table 9. Am29F160D Command Definitions................................... 22
CC
Write Inhibit ...................................................................... 18
Am29F160D
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 27
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 27
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 28
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Key to Switching Waveforms. . . . . . . . . . . . . . . . 30
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 31
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 42
TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 42
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 43
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 45
RY/BY#: Ready/Busy#............................................................ 24
DQ6: Toggle Bit I .................................................................... 24
DQ2: Toggle Bit II ................................................................... 24
Reading Toggle Bits DQ6/DQ2............................................... 24
DQ5: Exceeded Timing Limits ................................................ 25
DQ3: Sector Erase Timer ....................................................... 25
TTL/NMOS Compatible .......................................................... 28
CMOS Compatible.................................................................. 29
TSR048—48-Pin Reverse Thin Small Outline Package......... 44
Revision A (January 1999) ..................................................... 45
Revision B (June 14, 1999) .................................................... 45
Revision B+1 (July 7, 1999).................................................... 45
Revision B+2 (July 14, 1999).................................................. 45
Revision B+3 (July 30, 1999).................................................. 45
Revision B+4 (September 10, 1999) ...................................... 45
Revision C (November 16, 1999) ........................................... 45
Revision D (December 4, 2000) ............................................. 45
Revision D+1 (November 18, 2003) ....................................... 45
Figure 5. Data# Polling Algorithm .................................................. 23
Figure 6. Toggle Bit Algorithm........................................................ 25
Table 10. Write Operation Status................................................... 26
Figure 7. Maximum Negative Overshoot Waveform ...................... 27
Figure 8. Maximum Positive Overshoot Waveform........................ 27
Figure 9. Test Setup....................................................................... 30
Table 11. Test Specifications ......................................................... 30
Figure 10. Read Operations Timings ............................................. 31
Figure 11. RESET# Timings .......................................................... 32
Figure 12. BYTE# Timings for Read Operations............................ 33
Figure 13. BYTE# Timings for Write Operations............................ 33
Figure 14. Program Operation Timings.......................................... 35
Figure 15. Chip/Sector Erase Operation Timings .......................... 36
Figure 16. Data# Polling Timings (During Embedded Algorithms). 37
Figure 17. Toggle Bit Timings (During Embedded Algorithms)...... 37
Figure 18. DQ2 vs. DQ6................................................................. 38
Figure 19. Temporary Sector Unprotect Timing Diagram .............. 38
Figure 20. Sector Protect/Unprotect Timing Diagram .................... 39
Figure 21. Alternate CE# Controlled Write Operation Timings ...... 41
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