MM908E625ACDWB Freescale Semiconductor, MM908E625ACDWB Datasheet - Page 45

• Manufacturer Part Number: MM908E625ACDWB
• Description: IC QUAD HALF BRDG MCU/LIN 54SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MM908E625ACDWB

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• Ram Size: 512 x 8
• Interface: SCI, SPI
• Number Of I /o: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (0.300", 7.50mm Width) Exposed Pad
• Program Memory Size: 16 KB
• Number Of Programmable I/os: 54
• Number Of Timers: 16
• Operating Supply Voltage: - 18 V to + 28 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

98ARL105910.
Analog Integrated Circuit Device Data
Freescale Semiconductor
Important: For the most current revision of the package, visit
27
1
C
2X 27 TIPS
5.15
0.3
PIN 1 INDEX
A B C
10.3
7.6
7.4
B
A
A
VIEW C-C
0.30
10.9
9.7
54
28
A B
B
C
5
C
4
9
C
9
18.0
17.8
B
PACKAGING DIMENSIONS
PACKAGING
2.65
2.35
PLASTIC PACKAGE
98ARL105910
DWB SUFFIX
ISSUE B
0.30
54-PIN
R0.08 MIN
C L
www.freescale.com
5.3
4.8
54X
GAUGE PLANE
0.25
A
A B
52X
0.65
0.10 A
SEATING
PLANE
8 ˚
0 ˚
C
0.9
0.5
0 ˚
MIN
NOTES:
0.30
0.25
ROTATED 90˚ CLOCKWISE
6
1.
2.
3.
4.
5.
6.
7.
8.
9.
SECTION B-B
and perform a keyword search on
0.13
DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DATUMS B AND C TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF HTE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH AND PROTRUSIONS SHALL
NOT EXCEED 0.25 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED 0.46 MM. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD SHALL NOT BE LESS THAN
0.07 MM.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
THESE DIMENSIONS APPLY TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.1 MM AND
0.3 MM FROM THE LEAD TIP.
THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTER-LEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTOM
OF THE PLASTIC BODY.
SECTION A-A
(0.29)
0.38
0.22
M
0.1
0.0
A B
(0.25)
C
BASE METAL
(1.43)
PLATING
PACKAGING DIMENSIONS
8
PACKAGING
908E625
45