BLF6G22LS-130 NXP Semiconductors, BLF6G22LS-130 Datasheet

RF MOSFET Small Signal LDMOS TNS

BLF6G22LS-130

Manufacturer Part Number
BLF6G22LS-130
Description
RF MOSFET Small Signal LDMOS TNS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF6G22LS-130

Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.135 Ohms
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
13 V
Continuous Drain Current
34 A
Maximum Operating Temperature
+ 225 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Package / Case
SOT502B
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF6G22LS-130,112

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1. Product profile
CAUTION
1.1 General description
1.2 Features
130 W LDMOS power transistor for base station applications at frequencies from
2000 MHz to 2200 MHz.
Table 1.
RF performance at T
[1]
I
I
I
I
I
I
I
I
I
Mode of operation
2-carrier W-CDMA
BLF6G22LS-130
Power LDMOS transistor
Rev. 01 — 23 May 2008
Typical 2-carrier W-CDMA performance at frequencies of 2110 MHz and 2170 MHz, a
supply voltage of 28 V and an I
Easy power control
Integrated ESD protection
Excellent ruggedness
High efficiency
Excellent thermal stability
Designed for broadband operation (2000 MHz to 2200 MHz)
Internally matched for ease of use
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7 dB at 0.01 % probability on CCDF per carrier;
carrier spacing 10 MHz.
N
N
N
N
N
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
Average output power = 30 W
Power gain = 17 dB (typ)
Efficiency = 28.5 %
IMD3 = 37 dBc
ACPR = 40 dBc
Typical performance
case
f
(MHz)
2110 to 2170
= 25 C in a common source class-AB production test circuit.
Dq
V
(V)
28
of 1100 mA:
DS
P
(W)
30
L(AV)
G
(dB)
17
p
(%)
28.5
D
Product data sheet
IMD3
(dBc)
37
[1]
ACPR
(dBc)
40
[1]

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BLF6G22LS-130 Summary of contents

Page 1

... BLF6G22LS-130 Power LDMOS transistor Rev. 01 — 23 May 2008 1. Product profile 1.1 General description 130 W LDMOS power transistor for base station applications at frequencies from 2000 MHz to 2200 MHz. Table 1. RF performance at T Mode of operation 2-carrier W-CDMA [1] Test signal: 3GPP; test model 1; 64 DPCH; PAR = 0.01 % probability on CCDF per carrier; ...

Page 2

... LDMOST ceramic package; 2 leads Limiting values Parameter Conditions drain-source voltage gate-source voltage drain current storage temperature junction temperature Thermal characteristics Parameter thermal resistance from junction to case Rev. 01 — 23 May 2008 BLF6G22LS-130 Power LDMOS transistor Simplified outline Graphic symbol 1 3 [1] 2 Min - 0 ...

Page 3

... Symbol Parameter P L(AV IMD3 ACPR 7.1 Ruggedness in class-AB operation The BLF6G22LS-130 is capable of withstanding a load mismatch corresponding to VSWR = through all phases under the following conditions 1100 mA BLF6G22LS-130_1 Product data sheet Characteristics Conditions drain-source breakdown V voltage gate-source threshold voltage ...

Page 4

... NXP Semiconductors 7.2 One-tone CW Fig 1. BLF6G22LS-130_1 Product data sheet (dB 1100 mA 2170 MHz One-tone CW power gain and drain efficiency as functions of load power; typical values Rev. 01 — 23 May 2008 BLF6G22LS-130 Power LDMOS transistor 001aai093 (%) 120 160 P (W) L © NXP B.V. 2008. All rights reserved ...

Page 5

... 2169.95 MHz 2170.05 MHz 001aai095 IMD3 (dBc) IMD3 IMD5 IMD7 200 250 P (W) L(PEP) = 2169.95 MHz; 1 (1) I (2) I (3) I (4) I (5) I Fig 4. Rev. 01 — 23 May 2008 BLF6G22LS-130 Power LDMOS transistor 001aai094 60 D (%) 120 160 P ( (1) (2) (5) (3) ( 100 150 200 2169.95 MHz 2170 ...

Page 6

... BLF6G22LS-130_1 Product data sheet 001aai098 40 ACPR, D IMD3 (%) D (dBc ( 2157.5 MHz; 1 Fig 6. Rev. 01 — 23 May 2008 BLF6G22LS-130 Power LDMOS transistor IMD3 ACPR 1100 mA 2169.95 MHz 2170.05 MHz. 2 2-carrier W-CDMA adjacent channel leakage ratio and IMD3 as functions of average load power; typical values © NXP B.V. 2008. All rights reserved. ...

Page 7

... Figure 7) Value 3.6 pF 0.3 pF 1.2 pF 4.7 pF 100 220 nF 1 220 4.7 2.7 Rev. 01 — 23 May 2008 BLF6G22LS-130 Power LDMOS transistor C17 C13 C14 C10 C11 C12 OUTPUT PCB V2 001aai108 = 3.48 and thickness = 0.762 mm. r Remarks [1] [1] [1] TDK C4532X7R1E475M t020U or equivalent ...

Page 8

... REFERENCES JEDEC JEITA Rev. 01 — 23 May 2008 BLF6G22LS-130 Power LDMOS transistor 1.70 20.70 9.91 0.25 1.45 20.45 9.65 0.067 0.815 0.390 0.010 0.057 ...

Page 9

... Power of the Dedicated Physical CHannel Radio Frequency Surface Mounted Device Voltage Standing-Wave Ratio Wideband Code Division Multiple Access Release date Data sheet status 20080523 Product data sheet Rev. 01 — 23 May 2008 BLF6G22LS-130 Power LDMOS transistor Change notice Supersedes - - © NXP B.V. 2008. All rights reserved ...

Page 10

... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 01 — 23 May 2008 BLF6G22LS-130 Power LDMOS transistor © NXP B.V. 2008. All rights reserved ...

Page 11

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: BLF6G22LS-130_1 All rights reserved. Date of release: 23 May 2008 ...

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