BAV99,215 NXP Semiconductors, BAV99,215 Datasheet - Page 4

DIODE SW DBL 75V 215MA HS SOT23

BAV99,215

Manufacturer Part Number
BAV99,215
Description
DIODE SW DBL 75V 215MA HS SOT23
Manufacturer
NXP Semiconductors
Datasheets

Specifications of BAV99,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Current - Reverse Leakage @ Vr
500nA @ 80V
Current - Average Rectified (io) (per Diode)
215mA (DC)
Voltage - Dc Reverse (vr) (max)
100V
Reverse Recovery Time (trr)
4ns
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Series Connection
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
0.215 A
Max Surge Current
4 A
Configuration
Dual Series
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.5 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Rectifier Type
Switching Diode
Peak Rep Rev Volt
100V
Avg. Forward Curr (max)
0.215A
Rev Curr
0.5uA
Peak Non-repetitive Surge Current (max)
4A
Forward Voltage
1.25V
Operating Temp Range
-65C to 150C
Package Type
TO-236AB
Rev Recov Time
4ns
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1624-2
933215370215
BAV99 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAV99,215
Manufacturer:
NXP Semiconductors
Quantity:
4 800
Part Number:
BAV99,215
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
BAV99,215
Quantity:
10 000
NXP Semiconductors
6. Thermal characteristics
7. Characteristics
BAV99_SER
Product data sheet
Table 7.
[1]
[2]
[3]
Table 8.
T
[1]
[2]
Symbol
R
R
Symbol
Per diode
V
I
C
t
V
R
rr
amb
F
FR
th(j-a)
th(j-sp)
d
Single diode loaded.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Soldering points at pins 2, 3, 5 and 6.
When switched from I
When switched from I
= 25
°
C unless otherwise specified.
Parameter
forward voltage
reverse current
diode capacitance
reverse recovery time
forward recovery voltage
Thermal characteristics
Characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
BAV99
BAV99W
BAV99
BAV99S
BAV99W
All information provided in this document is subject to legal disclaimers.
F
F
Rev. 8 — 18 November 2010
= 10 mA to I
= 10 mA; t
r
= 20 ns.
R
= 10 mA; R
I
f = 1 MHz; V
Conditions
I
I
I
V
V
V
V
F
F
F
F
R
R
R
R
= 1 mA
= 10 mA
= 50 mA
= 150 mA
= 25 V
= 80 V
= 25 V; T
= 80 V; T
Conditions
in free air
L
= 100 Ω; measured at I
j
j
R
= 150 °C
= 150 °C
= 0 V
[1][2]
High-speed switching diodes
[3]
[1]
[2]
BAV99 series
Min
-
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
-
R
= 1 mA.
Typ
-
-
-
-
-
Typ
-
-
-
-
-
-
-
-
-
-
-
© NXP B.V. 2010. All rights reserved.
Max
500
625
360
260
300
Max
715
855
1
1.25
30
0.5
30
50
1.5
4
1.75
Unit
K/W
K/W
K/W
K/W
K/W
Unit
mV
mV
V
V
nA
μA
μA
μA
pF
ns
V
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