BAV99,215 NXP Semiconductors, BAV99,215 Datasheet - Page 7

• Manufacturer Part Number: BAV99,215
• Description: DIODE SW DBL 75V 215MA HS SOT23
• Manufacturer: NXP Semiconductors

Specifications of BAV99,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Current - Average Rectified (io) (per Diode): 215mA (DC)
• Voltage - Dc Reverse (vr) (max): 100V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Diode Configuration: 1 Pair Series Connection
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.215 A
• Max Surge Current: 4 A
• Configuration: Dual Series
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Rectifier Type: Switching Diode
• Peak Rep Rev Volt: 100V
• Avg. Forward Curr (max): 0.215A
• Rev Curr: 0.5uA
• Peak Non-repetitive Surge Current (max): 4A
• Forward Voltage: 1.25V
• Operating Temp Range: -65C to 150C
• Package Type: TO-236AB
• Rev Recov Time: 4ns
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1624-2; 933215370215; BAV99 T/R

NXP Semiconductors
9. Package outline
10. Packing information
BAV99_SER
Product data sheet
Fig 7.
Fig 9.
2.5
2.1
Dimensions in mm
1.4
1.2
Package outline BAV99 (SOT23/TO-236AB)
Package outline BAV99W (SOT323/SC-70)
1
1.9
3.0
2.8
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number Package
BAV99
BAV99S
BAV99W
3
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
2.2
2.0
Dimensions in mm
Packing methods
2
0.48
0.38
1.35
1.15
SOT23
SOT363
SOT323
0.45
0.15
All information provided in this document is subject to legal disclaimers.
1
Rev. 8 — 18 November 2010
1.1
0.9
0.15
0.09
04-11-04
Description
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel
2.2
1.8
1.3
3
Fig 8.
2
2.2
2.0
Dimensions in mm
0.4
0.3
0.45
0.15
1.35
1.15
Package outline BAV99S (SOT363/SC-88)
1.1
0.8
0.25
0.10
pin 1
index
1
0.65
6
04-11-04
1.3
2.2
1.8
Section
High-speed switching diodes
2
5
BAV99 series
[1]
4
3
14.
0.3
0.2
[2]
[3]
0.45
0.15
Packing quantity
3000
-215
-115
-125
-115
© NXP B.V. 2010. All rights reserved.
0.25
0.10
1.1
0.8
10000
-235
-135
-165
-135
06-03-16
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