BAV70T,115 NXP Semiconductors, BAV70T,115 Datasheet - Page 9

• Manufacturer Part Number: BAV70T,115
• Description: DIODE DUAL 100V 150MA SOT416
• Manufacturer: NXP Semiconductors

Specifications of BAV70T,115

• Package / Case: EMT3 (SOT-416, SC-75-3)
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Voltage - Forward (vf) (max) @ If: 1V @ 50mA
• Voltage - Dc Reverse (vr) (max): 100V
• Current - Average Rectified (io) (per Diode): 150mA (DC)
• Diode Configuration: 1 Pair Common Cathode
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.15 A
• Max Surge Current: 4 A
• Configuration: Dual Common Cathode
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934054727115::BAV70T T/R::BAV70T T/R

NXP Semiconductors
10. Packing information
11. Soldering
BAV70_SER_7
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number Package
BAV70
BAV70M
BAV70S
BAV70T
BAV70W
Fig 12. Reflow soldering footprint BAV70 (SOT23/TO-236AB)
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
3.00
Packing methods
0.85
0.85
SOT23
SOT883
SOT363
SOT416
SOT323
1.30
Rev. 07 — 27 November 2007
2
Description
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2.90
2.50
1.00
3.30
3
0.50 (3x)
0.60 (3x)
1
0.60
(3x)
sot023
2.70
Section
High-speed switching diodes
BAV70 series
[1]
Dimensions in mm
14.
[2]
[3]
solder lands
solder resist
solder paste
occupied area
Packing quantity
3000
-215
-
-115
-125
-115
-115
© NXP B.V. 2007. All rights reserved.
10000
-235
-315
-135
-165
-135
-135
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