BLF6G22-45,112 NXP Semiconductors, BLF6G22-45,112 Datasheet - Page 24

• Manufacturer Part Number: BLF6G22-45,112
• Description: IC BASESTATION DRIVER SOT608A
• Manufacturer: NXP Semiconductors

Specifications of BLF6G22-45,112

• Package / Case: SOT-608A
• Transistor Type: LDMOS
• Frequency: 2.11GHz
• Gain: 18.5dB
• Voltage - Rated: 65V
• Current Rating: 1.5µA
• Current - Test: 405mA
• Voltage - Test: 28V
• Power - Output: 2.5W
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Product Type: MOSFET Power
• Resistance Drain-source Rds (on): 0.2 Ohms
• Transistor Polarity: N-Channel
• Configuration: Single
• Drain-source Breakdown Voltage: 65 V
• Gate-source Breakdown Voltage: 13 V
• Maximum Operating Temperature: + 225 C
• Channel Type: N
• Channel Mode: Enhancement
• Drain Source Voltage (max): 65V
• Output Power (max): 2.5W(Typ)
• Power Gain (typ)@vds: 18.5@28VdB
• Frequency (min): 2GHz
• Frequency (max): 2.2GHz
• Package Type: CDFM
• Pin Count: 3
• Forward Transconductance (typ): 5S
• Drain Source Resistance (max): 200(Typ)@6.15Vmohm
• Operating Temp Range: -65C to 225C
• Drain Efficiency (typ): 13%
• Mounting: Screw
• Mode Of Operation: 2-Carrier W-CDMA
• Number Of Elements: 1
• Vswr (max): 10
• Screening Level: Military
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 934060066112; BLF6G22-45; BLF6G22-45

Wireless connectivity
Wireless connectivity: Wi-Fi (802.11)
Performance comparison: BGW200 vs. BGW211
4
Product
BGW211
BGW200
Frequency bands
Modulations
Data rates
Transmit power (15 dBm)
Receive power
Standard
compliance
802.11g
802.11b
External
components
required
0
3
Design
footprint
(mm
BGW200
2.4 to 2.5 GHz
DBPSK, DQPSK, CCK (DSSS)
1, 2, 5.5, 11 Mbps
731 mW
415 mW
2
150
180
)
Standby
power
consumption
< 2 mW
< 2 mW
Bluetooth
1.1/1.2
coexistence QoS
•
•
•
•
ARM7
processor Integrated memory
•
•
BGW211
2.4 to 2.5 GHz
DBPSK, DQPSK, CCK (DSSS), OFDM
1, 2, 5.5 Mbps (802.11b)
6, 9, 12, 18, 24, 36, 48, 54 Mbps (802.11g)
550 mW (802.11b)
600 mW (802.11g)
300 mW (802.11b)
400 mW (802.11g)
1.25-MB SRAM
256-KB ROM
1.25-MB SRAM
256-KB ROM
Host
interfaces
Optimized
SDIO/SPI
Optimized
SDIO/SPI
SiP package
dimensions (mm)
10 x 15 x 1.3
10 x 15 x 1.3
Pins
68
68