MT48LC8M16A2B4-75:G TR Micron Technology Inc, MT48LC8M16A2B4-75:G TR Datasheet - Page 35

DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin VFBGA T/R

MT48LC8M16A2B4-75:G TR

Manufacturer Part Number
MT48LC8M16A2B4-75:G TR
Description
DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin VFBGA T/R
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC8M16A2B4-75:G TR

Density
128 Mb
Maximum Clock Rate
133 MHz
Package
54VFBGA
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (8Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
54-VFBGA
Organization
8Mx16
Address Bus
14b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Figure 24:
Figure 25:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
WRITE-to-PRECHARGE
Terminating a WRITE Burst
Notes:
Notes:
COMMAND
COMMAND
1. DQM could remain LOW in this example if the WRITE burst is a fixed length of two.
COMMAND
1. DQMs are LOW.
t WR @ t CLK ≥ 15ns
t WR = t CLK < 15ns
ADDRESS
ADDRESS
ADDRESS
DQM
DQM
CLK
DQ
DQ
CLK
TRANSITIONING DATA
DQ
BANK a,
BANK a,
WRITE
WRITE
BANK,
COL n
COL n
WRITE
COL n
D
D
T0
D
n
n
T0
IN
IN
n
IN
TERMINATE
n + 1
n + 1
BURST
NOP
NOP
T1
D
D
T1
IN
IN
t
WR
35
PRECHARGE
COMMAND
(ADDRESS)
(a or all)
DON’T CARE
BANK
(DATA)
T2
NOP
T2
NEXT
t
WR
TRANSITIONING DATA
PRECHARGE
(a or all)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
BANK
T3
NOP
t RP
NOP
NOP
T4
t RP
128Mb: x4, x8, x16 SDRAM
BANK a,
ACTIVE
ROW
NOP
T5
©1999 Micron Technology, Inc. All rights reserved.
DON’T CARE
BANK a,
ACTIVE
ROW
NOP
T6
Operations

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