BUL810 STMicroelectronics, BUL810 Datasheet
BUL810
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BUL810
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BUL810 Summary of contents
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... Electronic ballast for fluorescent lighting ■ Switch mode power supplies. Description The BUL810 is manufactured using high voltage multiepitaxial mesa technology for cost-effective high performance. It uses a hollow emitter structure to enhance switching speeds. The BUL series is designed for use in lighting applications and low cost switch-mode power supplies ...
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... T Max. operating junction temperature J Table 3. Thermal data Symbol R Thermal resistance junction-case thj-case R Thermal resistance junction-ambient thj-amb 2/10 Parameter = < 5 ms) P < °C c Parameter __max __max BUL810 Value Unit 1000 V 450 125 W -65 to 150 °C 150 °C Value Unit 1 °C/W 30 °C/W ...
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... BUL810 2 Electrical characteristics ( °C unless otherwise specified) case Table 4. Electrical characteristics Symbol Collector cut-off current I CES (V BE Collector cut-off current I CEO ( Collector-emitter (1) V CEO(sus) sustaining voltage ( Emitter-base voltage V EBO ( (1) Collector-emitter V CE(sat) saturation voltage Base-emitter saturation (1) V BE(sat) voltage ( current gain FE Inductive load ...
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... Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 4. DC current gain Figure 6. Collector-emitter saturation voltage 4/10 Figure 3. Derating curve Figure 5. DC current gain Figure 7. Base-emitter saturation voltage BUL810 ...
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... BUL810 Figure 8. Inductive load fall time Figure 10. Reverse biased safe operating area Electrical characteristics Figure 9. Inductive storage fall time 5/10 ...
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... Electrical characteristics 2.2 Test circuit Figure 11. Inductive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor 3) Fast recovery rectifier 6/10 BUL810 ...
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... BUL810 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Package mechanical data Dim øP øR S 8/10 TO-247 Mechanical data mm. Min. Typ 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 BUL810 Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 14.80 4.30 3.65 5.50 ...
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... BUL810 4 Revision history Table 5. Document revision history Date 01-Feb-2003 12-Feb-2008 Revision 3 4 Package change from TO-218 to TO-247. Revision history Changes 9/10 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com BUL810 ...