MCP1631-E/ML Microchip Technology, MCP1631-E/ML Datasheet - Page 24

IC,SMPS CONTROLLER,CURRENT-MODE,LLCC,20PIN,PLASTIC

MCP1631-E/ML

Manufacturer Part Number
MCP1631-E/ML
Description
IC,SMPS CONTROLLER,CURRENT-MODE,LLCC,20PIN,PLASTIC
Manufacturer
Microchip Technology
Datasheet

Specifications of MCP1631-E/ML

Pwm Type
Current Mode
Number Of Outputs
1
Frequency - Max
2MHz
Duty Cycle
10%
Voltage - Supply
3 V ~ 5.5 V
Buck
Yes
Boost
No
Flyback
No
Inverting
No
Doubler
No
Divider
No
Cuk
No
Isolated
Yes
Operating Temperature
-40°C ~ 125°C
Package / Case
20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
Frequency-max
2MHz
Output Voltage
3.3 V to 5 V
Output Current
250 mA
Input Voltage
3 V to 5.5 V
Switching Frequency
2 MHz
Operating Temperature Range
- 40 C to + 125 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MCP1631/HV/MCP1631V/VHV
DS22063A-page 24
20-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
A3
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
A1
2
1
EXPOSED
A
E
Units
PAD
NOTE 1
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
1
2
MIN
0.80
0.00
2.60
2.60
0.18
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
0.50 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.70
2.70
0.25
0.40
20
Microchip Technology Drawing C04-126B
D2
© 2007 Microchip Technology Inc.
MAX
1.00
0.05
2.80
2.80
0.30
0.50
L
b
K
e

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