MC44BS374T1AEF Freescale, MC44BS374T1AEF Datasheet - Page 32

• Manufacturer Part Number: MC44BS374T1AEF
• Manufacturer: Freescale

Specifications of MC44BS374T1AEF

• Lead Free Status / RoHS Status: Compliant

Packaging Instructions
21 Packaging Instructions
Tape and reel packaging per 12MRH00360A issue Y with the following conditions applicable for Dual In-
Line SOP (SOIC) package.
Component Orientation: Arrange parts with the pin 1 side closest to the tape's round sprocket holes on the
tape's trailing edge.
22 Marking Instructions
Bar marked part way across Pin 1 end of package.
Bar width 10 to 20 mils, length to be at least four
times Bar width. Bar placement may extend across
chamfer and dimple areas.
Bar marked part way across Pin 1 end of package.
Bar width 10 to 20 mils, length to be at least four
times Bar width. Bar placement may extend across
chamfer and dimple areas.
• 1st line:
• 2nd line:
• 1st line:
• 2nd line:
MCBS374T1 (Part number coded on 9 digits)
Assembly site code AW (2 digits) followed by the
wafer lot code L (1 digit),
year Y (1 digit) and
work week WW (2 digits)
MCBS374T1A (Part number coded on 10 digits)
Assembly site code AW (2 digits) followed by the
wafer lot code L (1 digit),
year Y (1 digit) and
work week WW (2 digits)
Freescale Semiconductor, Inc.
MC44BS374T1/374T1A Advance Information
For More Information On This Product,
Figure 17. Dual In-line SOP (SOIC)
Go to: www.freescale.com
Pin 1 Dot or Dimple
Pin 1 Dot or Dimple
MCBS374T1
MCBS374T1A
AWLYWW
AWLYWW