HSDL-3612-007 Lite-On Electronics, HSDL-3612-007 Datasheet - Page 17

• Manufacturer Part Number: HSDL-3612-007
• Description: Infrared Transceivers IR Transceiver 115.2Kb/s
• Manufacturer: Lite-On Electronics
• Type: TX/RXr

Specifications of HSDL-3612-007

• Pulse Width: 1.6/4us
• Led Supply Voltage: -0.5 to 7V
• Dimensions: 12.2x5.1x4
• Peak Wavelength: 875/880nm
• Angle Of Half Sensitivity: 60/30°
• Communication Distance: 150
• Package Type: Ultra Small Profile
• Fall Time: 40/25ns
• Rise Time: 40/25ns
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 5.25V
• Mounting: Surface Mount
• Pin Count: 10
• Operating Temp Range: -20C to 70C
• Operating Temperature Classification: Commercial
• Data Rate: 115.2Kbps
• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 1.5 m
• Radiant Intensity: 120 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Maximum Rise Time: 40 ns, 25 ns
• Maximum Fall Time: 40 ns, 25 ns
• Maximum Forward Current: 165 mA
• Operating Voltage: 2.7 V to 5.25 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Idle Current, Typ @ 25° C: 2.5mA
• Link Range, Low Power: 1m
• Operating Temperature: -20°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 12.2mm x 5.1mm x 4mm
• Standards: IrPHY 1.0
• Supply Voltage: 2.7 V ~ 5.25 V
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Compliant

17
Figure 4.0. Solder paste stencil aperture.
2.1 Recommended Metal Solder Stencil Aperture
It is recommended that only 0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. The following combina-
tion of metal stencil aperture and metal stencil thick-
ness should be used:
0.152
0.127
3.0
Product Self-Alignment after Solder Reflow
If the printed solder paste volume is adequate, the unit
will self-align in the X-direction after solder reflow.
Units should be properly reflowed in IR Hot Air convec-
tion oven using the recommended reflow profile. The
direction of board travel does not matter.
See Fig 4.0
t, nominal stencil thickness
mm
l
Pick and Place Misalignment Tolerance and
SOLDER
PASTE
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
inches
0.006
0.005
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
mm
2.8 ± 0.05
3.4 ± 0.05
APERTURE AS PER
LAND DIMENSIONS
w
l, length of aperture
X – direction ≤ 0.2 mm (0.008 inches)
Theta – direction ± 2 degrees
Allowable Misalignment Tolerance
t (STENCIL THICKNESS)
inches
0.110 ± 0.002
0.134 ± 0.002