MCIMX257DJM4A Freescale, MCIMX257DJM4A Datasheet - Page 19

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MCIMX257DJM4A

Manufacturer Part Number
MCIMX257DJM4A
Description
Manufacturer
Freescale
Datasheet

Specifications of MCIMX257DJM4A

Operating Temperature (min)
-20C
Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant

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Manufacturer
Quantity
Price
Part Number:
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Part Number:
MCIMX257DJM4A
Manufacturer:
Freescale Semiconductor
Quantity:
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The method for obtaining the maximum current is as follows:
3.4
The thermal resistance characteristics for the device are given in
under the following conditions:
Freescale Semiconductor
1
Junction to ambient
Junction to ambient
The FUSE_VDD rail is connected to ground. it only needs a voltage if the system fuse burning is needed.
1. Measure the worst case power consumption on individual rails using directed test on i.MX25.
2. Correlate the worst case power consumption power measurements with the worst case power
3. Combine common voltage rails based on the power supply sequencing requirements (add the
4. Guard the worst case numbers for temperature and process variation.
5. The sum of individual rails is greater than the real world power consumption, since a real
6. BATT_VDD current is measured when the system is in reduced power mode maintaining the
consumption simulations.
worst case power consumption on each rail within some test cases from several test cases run, to
maximize different rails in the power group).
system does not typically maximize the power consumption on all peripherals
simultaneously.
RTC. When the system is in run mode, QVDD is used to supply the DryIce, so this current
becomes negligible. Refer to
Two-layer substrate
Substrate solder mask thickness: 0.025 mm
Substrate metal thicknesses: 0.016 mm
Substrate core thickness: 0.200 mm
Core through I.D: 0.118 mm, Core through plating 0.016 mm.
Flag: Trace style with ground balls under the die connected to the flag
Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K
Mold compound: Generic mold compound; k = 0.9 W/m K
Thermal Characteristics
The values mentioned above should not be taken as a typical max run data
for specific use cases. These values are Absolute MAX data. Freescale
recommends that the system current measurements are taken with
customer-specific use-cases to reflect normal operating conditions in the
end system
1
1
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 6
natural convection
natural convection
Rating
Table 14. Thermal Resistance Data
Table
10, for more details on the power modes.
Single layer board (1s)
Four layer board (2s2p)
NOTE
Condition
Table
14. These values are measured
Symbol
R
R
eJA
eJA
Value
55
33
°C/W
°C/W
Unit
19

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