PCA9306D.112 NXP Semiconductors, PCA9306D.112 Datasheet - Page 16

• Manufacturer Part Number: PCA9306D.112
• Manufacturer: NXP Semiconductors

Specifications of PCA9306D.112

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Package Type: SO
• Pin Count: 8
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
Fig 16. Package outline SOT765-1 (VSSOP8)
PCA9306
Product data sheet
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT765-1
max.
A
1
0.15
0.00
A 1
8
1
Z
0.85
0.60
A 2
y
IEC
e
0.12
A 3
pin 1 index
D
0
0.27
0.17
b p
b p
All information provided in this document is subject to legal disclaimers.
MO-187
0.23
0.08
5
JEDEC
4
c
w
REFERENCES
D
Rev. 6 — 25 November 2010
2.1
1.9
M
(1)
Dual bidirectional I
E
2.4
2.2
(2)
c
JEITA
scale
2.5
0.5
e
A
H E
3.2
3.0
A 2
detail X
A 1
0.4
2
L
C-bus and SMBus voltage-level translator
H E
E
0.40
0.15
L p
0.21
0.19
Q
5 mm
L
L p
PROJECTION
EUROPEAN
Q
0.2
v
A
(A 3 )
0.13
w
X
θ
v
PCA9306
M
0.1
y
© NXP B.V. 2010. All rights reserved.
A
ISSUE DATE
02-06-07
Z
0.4
0.1
(1)
SOT765-1
8°
0°
θ
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