X9250US24Z-2.7 Intersil, X9250US24Z-2.7 Datasheet - Page 2

• Manufacturer Part Number: X9250US24Z-2.7
• Description: IC XDCP QUAD 256TP 50K 24-SOIC
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X9250US24Z-2.7

• Taps: 256
• Resistance (ohms): 50K
• Number Of Circuits: 4
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Resistance In Ohms: 50K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9250TS24I
X9250TS24IZ (Note)
X9250TV24I
X9250TV24IZ (Note)
X9250US24
X9250US24Z (Note)
X9250US24I
X9250US24IZ (Note)
X9250UV24I
X9250UV24IZ (Note)
X9250TS24-2.7
X9250TS24Z-2.7 (Note) X9250TS ZF
X9250TS24I-2.7*
X9250TS24IZ-2.7*
(Note)
X9250TV24I-2.7
X9250TV24IZ-2.7 (Note) X9250TV ZG
X9250US24-2.7*
X9250US24Z-2.7* (Note) X9250US ZF
X9250US24I-2.7
X9250US24IZ-2.7 (Note) X9250US ZG
X9250UV24-2.7
X9250UV24Z-2.7 (Note) X9250UV ZF
X9250UV24I-2.7
X9250UV24IZ-2.7 (Note) X9250UV ZG
PART NUMBER
X9250TS I
X9250TS ZI
X9250TV I
X9250TV ZI
X9250US
X9250US Z
X9250US I
X9250US ZI
X9250UV I
X9250UV ZI
X9250TS F
X9250TS G
X9250TS ZG
X9250TV G
X9250US F
X9250US G
X9250UV F
X9250UV G
MARKING
PART
2
V
CC
-2.7 to 5.5
5 ±10%
LIMITS (V)
ORGANIZATION (kΩ)
POTENTIOMETER
X9250
100
100
50
50
TEMP. RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
(°C)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP
(4.4mm)
24 Ld TSSOP
(4.4mm) (Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP
(4.4mm)
(4.4mm) (Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP
(4.4mm)
24 Ld TSSOP
(4.4mm) (Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP
(4.4mm)
(4.4mm) (Pb-free)
24 Ld TSSOP
(4.4mm)
(4.4mm) (Pb-free)
24 Ld TSSOP
24 Ld TSSOP
24 Ld TSSOP
PACKAGE
PKG. DWG. #
M24.3
M24.3
MDP0044
MDP0044
M24.3
M24.3
M24.3
M24.3
MDP0044
MDP0044
M24.3
M24.3
M24.3
MDP0044
MDP0044
M24.3
M24.3
M24.3
M24.3
MDP0044
MDP0044
MDP0044
MDP0044
M24.3
August 29, 2006
FN8165.3