LP3929TME-AACQ National Semiconductor, LP3929TME-AACQ Datasheet
LP3929TME-AACQ
Specifications of LP3929TME-AACQ
Related parts for LP3929TME-AACQ
LP3929TME-AACQ Summary of contents
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... Specific Integrated Passives chip integrated pull-up, pull-down, series resistors and capacitors for EMC filtering designed to tolerate IEC61000-4-2 level 4 ESD: ±15 kV air discharge, ±8 kV direct contact. Typical Application Circuit © 2007 National Semiconductor Corporation Key Specifications Level Shifter: ■ 6-signal Level Shifter (5 bi-directional and 1 uni-direction) ■ ...
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Block Diagram www.national.com 20186802 2 ...
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... Output Voltage Grade LP3929 Supplied As 250 Units, Tape & Reel 2.85 V STD LP3929TME-AACQ Tape and Reel Information Note: The actual physical placement of the package marking will vary from part to part. The package marking “XY” will designate the date code. The “TT” NSC internal code for die traceability ...
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Pin Descriptions micro SMD Pin Name Port / Direction Bump Identifier D0_A D1 Host / Bidirectional D1_A E1 Host / Bidirectional D2_A A1 Host / Bidirectional D3_A B1 Host / Bidirectional CMD_A D2 Host / Bidirectional CLK_A C1 fCLK_A E2 ...
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Inputs EN CMD_DIR DIR_0 DIR_1 ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (V ) BAT Supply Voltage (V ) DDA LVCMOS A Port Input Voltage LVCMOS A Port I/O Voltage LVCMOS A Port I/O Voltage Junction Temperature Storage Temperature ...
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Electrical Characteristics Typical values and limits appearing in standard typeface apply for T entire ambient temperature range for operation, −30°C to +85°C. (Notes 3, 4) Symbol Parameter Supply Current I Supply Current DD I Supply Current — Shutdown DDZ C ...
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... Note 11: Range of capacitor ESR values for which the device will remain stable. This electrical specification is guaranteed by design. Note 12: The built-in thermal shut-down of the LDO is also used to put all A and B outputs in tri-state mode. Note 13: Additional information on lead temperature and pad temperature can be found in National Semiconductor Application Note (AN-1112). Note 14: Unused inputs must be terminated. ...
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FIGURE Timing Diagram (propagation delay, skew) FIGURE 2. Output Transition Time (A and B Side) 9 20186805 20186806 www.national.com ...
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Typical Performance Characteristics 1 µ BAT DDA ASIP / EMI Filter Response www.national.com FIGURE Direction (37 MHz Example) Unless otherwise specified 25°C. A Power Supply ...
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... CMOS RAM keep-alive applica- tions. MICRO SMD ASSEMBLY For assembly recommendations of micro SMD package please refer to National Semiconductor Application Note AN-1112. MICRO SMD LIGHT SENSITIVITY Exposing the micro SMD device to direct sunlight will cause misoperation of the device. Light sources such as Halogen lamps can effect electrical performance if brought near to the device ...
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Physical Dimensions www.national.com inches (millimeters) unless otherwise noted micro SMD, 24 Bump NS Package Number: TME24AAA The dimensions for X1, X2 and X3 are as follows 2.015mm ± 30μ 2.015mm ± 30μ 0.600mm ± ...
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Notes 13 www.national.com ...
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... For more National Semiconductor product information and proven design tools, visit the following Web sites at: Products Amplifiers www.national.com/amplifiers Audio www.national.com/audio Clock Conditioners www.national.com/timing Data Converters www.national.com/adc Displays www.national.com/displays Ethernet www.national.com/ethernet Interface www.national.com/interface LVDS www.national.com/lvds Power Management www.national.com/power Switching Regulators www.national.com/switchers LDOs www ...