NJVMJD32CT4G ON Semiconductor, NJVMJD32CT4G Datasheet - Page 10

• Manufacturer Part Number: NJVMJD32CT4G
• Manufacturer: ON Semiconductor

L3
L4
b2
e
1
b3
4
2
E
3
b
A
D
0.005 (0.13)
B
MJD32C, NJVMJD32CG, NJVMJD32CT4G (PNP)
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
M
DETAIL A
C
0.228
5.80
c
L2
A
GAUGE
PLANE
SOLDERING FOOTPRINT*
PACKAGE DIMENSIONS
ROTATED 90 CW
0.244
6.20
c2
DETAIL A
H
C
http://onsemi.com
L
CASE 369C−01
L1
ISSUE D
DPAK
5
0.101
2.58
10
A1
0.118
3.0
H
0.063
1.6
SCALE 3:1
C
Z
SEATING
PLANE
6.172
0.243
inches
NOTES:
mm
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
5. DIMENSIONS D AND E ARE DETERMINED AT THE
6. DATUMS A AND B ARE DETERMINED AT DATUM
Y14.5M, 1994.
MENSIONS b3, L3 and Z.
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
OUTERMOST EXTREMES OF THE PLASTIC BODY.
PLANE H.
STYLE 1:
DIM
A1
b2
b3
L1
L2
L3
L4
c2
PIN 1. BASE
A
b
c
D
E
e
H
L
Z
2. COLLECTOR
3. EMITTER
4. COLLECTOR
0.086
0.000
0.025
0.030
0.180
0.018
0.018
0.235
0.250
0.370
0.055
0.035
0.155
MIN
−−−
0.090 BSC
0.108 REF
0.020 BSC
INCHES
0.094
0.005
0.035
0.045
0.215
0.024
0.024
0.245
0.265
0.410
0.070
0.050
0.040
MAX
−−−
MILLIMETERS
MIN
2.18
0.00
0.63
0.76
4.57
0.46
0.46
5.97
6.35
9.40
1.40
0.89
3.93
−−−
2.29 BSC
2.74 REF
0.51 BSC
10.41
MAX
2.38
0.13
0.89
1.14
5.46
0.61
0.61
6.22
6.73
1.78
1.27
1.01
−−−