XC4010L-5PQ208C Xilinx Inc, XC4010L-5PQ208C Datasheet - Page 77

• Manufacturer Part Number: XC4010L-5PQ208C
• Description: IC 3.3V FPGA 400 CLB'S 208-PQFP
• Manufacturer: Xilinx Inc
• Series: XC4000r

Specifications of XC4010L-5PQ208C

• Number Of Logic Elements/cells: 950
• Number Of Labs/clbs: 400
• Total Ram Bits: 12800
• Number Of I /o: 160
• Number Of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 208-BFQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 122-1124

XC4000E Absolute Maximum Ratings
Note 1:
Note 2:
XC4000E Program Readback Switching Characteristic Guidelines
Testing of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100%
functionally tested. Internal timing parameters are not measured directly. They are derived from benchmark timing patterns
that are taken at device introduction, prior to any process improvements.
The following guidelines reflect worst-case values over the recommended operating conditions.
Note 1:
Note 2:
September 18, 1996 (Version 1.04)
V
V
V
T
T
T
rdbk.TRIG
rdclk.1
STG
SOL
J
CC
IN
TS
Symbol
Maximum DC overshoot or undershoot above Vcc or below GND must be limited to either 0.5 V or 10 mA, whichever is
easier to achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot to Vcc + 2.0 V, provided this
over- or undershoot lasts less than 20 ns.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may
affect device reliability.
Timing parameters apply to all speed grades.
If rdbk.TRIG is High prior to Finished, Finished will trigger the first Readback.
Internal Net
Supply voltage relative to GND
Input voltage relative to GND (Note 1)
Voltage applied to 3-state output (Note 1)
Storage temperature (ambient)
Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
Junction temperature
rdbk.DATA
rdbk.TRIG
rdbk.RIP
Finished
rdclk.I
Description
rdbk.TRIG setup to initiate and abort Readback
rdbk.TRIG hold to initiate and abort Readback
rdbk.DATA delay
rdbk.RIP delay
High time
Low time
4
1
T
T
RCL
RTRC
T
RCRT
DUMMY
T
T
RCRD
T
RCRR
RCH
2
7
5
6
Description
DUMMY
1
T
RTRC
VALID
T
RCRT
VALID
Ceramic packages
Plastic packages
1
2
7
6
5
4
2
Symbol
T
T
T
T
T
T
RCRD
RCRR
RTRC
RCRT
RCH
RCL
Min
200
250
250
50
-
-
-0.5 to V
-0.5 to V
-0.5 to +7.0
-65 to +150
+260
+150
+125
Max
250
250
500
500
CC
CC
-
-
X1790
+0.5
+0.5
Units
Units
ns
ns
ns
ns
ns
ns
V
V
V
C
C
C
C
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