MM908E626AVDWB Freescale Semiconductor, MM908E626AVDWB Datasheet - Page 5

• Manufacturer Part Number: MM908E626AVDWB
• Description: IC STEPPER MOTOR DRIVER 54-SOIC
• Manufacturer: Freescale Semiconductor
• Type: Stepper Motor Driverr

Specifications of MM908E626AVDWB

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• Ram Size: 512 x 8
• Interface: SCI, SPI
• Number Of I /o: 13
• Voltage - Supply: 8 V ~ 18 V
• Operating Temperature: -40°C ~ 115°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (7.5mm Width) Exposed Pad, 54-eSOIC, 54-HSOIC
• Product: Stepper Motor Controllers / Drivers
• Operating Supply Voltage: 8 V to 18 V
• Supply Current: 20 mA
• Mounting Style: SMD/SMT
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Analog Integrated Circuit Device Data
Freescale Semiconductor
Table 2. MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
the device.
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
Supply Voltage
Input Pin Voltage
Maximum Microcontroller Current per Pin
Maximum Microcontroller V
Maximum Microcontroller V
LIN Supply Voltage
ESD Voltage
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Solder Mounting
1.
2.
3.
4.
5.
6.
7.
Analog Chip Supply Voltage under Normal Operation (Steady-
state)
Analog Chip Supply Voltage under Transient Conditions
Microcontroller Chip Supply Voltage
Analog Chip
Microcontroller Chip
All Pins Except VDD, VSS, PTA0 : PTA6, PTC0 : PTC1
Pins PTA0 : PTA6, PTC0 : PTC1
Normal Operation (Steady-state)
Transient Conditions
Human Body Model
Machine Model
Charge Device Model
Transient capability for pulses with a time of t < 0.5 sec.
ESD1 testing is performed in accordance with the Human Body Model (C
ESD2 testing is performed in accordance with the Machine Model (C
ESD3 testing is performed in accordance with Charge Device Model, robotic (C
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions
Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
(3)
(2)
(1)
(4)
SS
DD
(5)
Rating
Output Current
Input Current
(6)
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
(1)
(7)
V
V
BUS(DYNAMIC)
ZAP
IN
V
V
V
V
T
Symbol
SUP(
SUP(
IN
I
I
I
BUS(SS)
V
V
V
SOLDER
I
(ANALOG)
T
PIN
PIN
MVDD
MVSS
V
ESD1
ESD2
ESD3
STG
T
T
(MCU)
= 200pF, R
DD
ZAP
C
J
(1)
(2)
SS
PK
= 100pF, R
)
)
ZAP
= 4.0pF).
ZAP
= 0Ω).
ZAP
V
= 1500Ω).
SS
- 0.3 to V
- 0.3 to 6.0
- 0.3 to 5.5
- 40 to 150
- 40 to 115
- 40 to 135
ELECTRICAL CHARACTERISTICS
- 0.3 to 28
- 0.3 to 40
-18 to 28
± 3000
Value
± 150
± 500
±15
± 25
100
100
245
40
DD
+ 0.3
MAXIMUM RATINGS
Unit
mA
mA
mA
908E626
°C
°C
°C
°C
V
V
V
V
5