MPC866PZP133A Freescale Semiconductor, MPC866PZP133A Datasheet - Page 13

• Manufacturer Part Number: MPC866PZP133A
• Description: IC MPU POWERQUICC 133MHZ 357PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICCr

Specifications of MPC866PZP133A

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 133MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 133 MHz
• Maximum Operating Temperature: + 95 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 133MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Core Size: 32 Bit
• Program Memory Size: 24KB
• Cpu Speed: 133MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 357
• Supply Voltage Range: 1.7V To 1.9V
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

If the board temperature is known, an estimate of the junction temperature in the environment can be made using
the following equation:
T
where:
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and vias attaching the thermal balls to the ground plane.
7.4
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application [2], or a more accurate and complex model of the
package can be used in the thermal simulation.
Freescale Semiconductor
J
= T
B
R
T
P
+(R
Estimation Using Simulation
D
B
θJB
= board temperature ºC
= power dissipation in package
θJB x
= junction-to-board thermal resistance (ºC/W)
P
D
)
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
MPC866/MPC859 Hardware Specifications, Rev. 2
Thermal Calculation and Measurement
13