MPC866PZP133A Freescale Semiconductor, MPC866PZP133A Datasheet - Page 9

• Manufacturer Part Number: MPC866PZP133A
• Description: IC MPU POWERQUICC 133MHZ 357PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICCr

Specifications of MPC866PZP133A

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 133MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Processor Series: MPC8xx
• Core: MPC8xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 133 MHz
• Maximum Operating Temperature: + 95 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 133MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Core Size: 32 Bit
• Program Memory Size: 24KB
• Cpu Speed: 133MHz
• Digital Ic Case Style: BGA
• No. Of Pins: 357
• Supply Voltage Range: 1.7V To 1.9V
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

4
Table 4
Freescale Semiconductor
1
2
3
4
5
6
Junction-to-ambient
Junction-to-board
Junction-to-case
Junction-to-package top
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
measured on the top surface of the board near the package.
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
temperature per JEDEC JESD51-2.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
Thermal Characteristics
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
Thermal characterization parameter indicating the temperature difference between package top and junction
shows the thermal characteristics for the MPC866/859.
Rating
5
4
1
6
Table 4. MPC866/859 Thermal Resistance Data
MPC866/MPC859 Hardware Specifications, Rev. 2
Natural Convection
Airflow (200 ft/min)
Natural Convection
Airflow (200 ft/min)
Environment
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
Symbol
R
R
R
R
R
R
θJMA
θJMA
θJMA
Ψ
Ψ
θJA
θJC
θJB
JT
JT
2
3
3
3
Thermal Characteristics
Value
37
23
30
19
13
6
2
2
°C/W
Unit
9