MPC8347ZUAJFB Freescale Semiconductor, MPC8347ZUAJFB Datasheet - Page 84

• Manufacturer Part Number: MPC8347ZUAJFB
• Description: IC MPU PWRQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8347ZUAJFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 533MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

Thermal
20 Thermal
This section describes the thermal specifications of the MPC8347E.
20.1
Table 61
Table 62
84
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (@ 200 ft/min) on single-layer board (1s)
Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (@ 2 m/s) on single-layer board (1s)
Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Junction-to-package natural convection on top
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (@ 200 ft/min) on single-layer board (1s)
Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p)
Junction-to-board thermal
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
provides the package thermal characteristics for the 672 35 × 35 mm TBGA of the MPC8347E.
provides the package thermal characteristics for the 620 29 × 29 mm PBGA of the MPC8347E.
Thermal Characteristics
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Characteristic
Characteristic
Table 61. Package Thermal Characteristics for TBGA
Table 62. Package Thermal Characteristics for PBGA
Symbol
R
R
R
R
R
R
R
R
Symbol
ψ
θJMA
θJMA
θJMA
θJMA
θJMA
R
R
R
θJC
θJA
θJB
R
R
JT
θJMA
θJMA
θJMA
θJA
θJB
Value
Value
3.8
1.7
14
11
11
8
9
7
1
21
15
17
12
6
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
Notes
Notes
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
1, 2
1, 3
1, 3
1, 3
4
4
5
6