MPC8347ZUAJFB Freescale Semiconductor, MPC8347ZUAJFB Datasheet - Page 90
MPC8347ZUAJFB
Manufacturer Part Number
MPC8347ZUAJFB
Description
IC MPU PWRQUICC II 672-TBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8347CVVAGDB.pdf
(102 pages)
Specifications of MPC8347ZUAJFB
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
672-TBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
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Thermal
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate
the case temperature using a separate measurement of the thermal resistance of the interface. From this
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.
where:
90
T
T
R
P
J
C
θ
D
JC
= junction temperature (°C)
= case temperature of the package (°C)
= power dissipation (W)
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
= junction-to-case thermal resistance (°C/W)
T
J
= T
C
+ (R
θ
JC
× P
D
)
Freescale Semiconductor