MPC8541EPXAQF Freescale Semiconductor, MPC8541EPXAQF Datasheet - Page 55

IC MPU POWERQUICC III 783-FCPBGA

MPC8541EPXAQF

Manufacturer Part Number
MPC8541EPXAQF
Description
IC MPU POWERQUICC III 783-FCPBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIIr
Datasheets

Specifications of MPC8541EPXAQF

Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
1.0GHz
Voltage
1.3V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
1GHz
Embedded Interface Type
I2C, SPI, UART
Digital Ic Case Style
BGA
No. Of Pins
783
Rohs Compliant
No
For Use With
MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8541EPXAQF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
14.2
Figure 41
package.
Notes:
Freescale Semiconductor
1.
2.
3.
4.
5.
6.
7.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices.
Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
The socket lid must always be oriented to A1.
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Mechanical Dimensions of the FC-PBGA
Figure 41. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA
the mechanical dimensions and bottom surface nomenclature of the MPC8541E 783 FC-PBGA
Package and Pin Listings
55

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