PIC18F4620-I/PT Microchip Technology Inc., PIC18F4620-I/PT Datasheet - Page 6

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PIC18F4620-I/PT

Manufacturer Part Number
PIC18F4620-I/PT
Description
44 Pin, 64 KB Flash, 3968 RAM, 36 I/O
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC18F4620-I/PT

A/d Inputs
13-Channel, 10-Bit
Comparators
2
Cpu Speed
10 MIPS
Eeprom Memory
1024 Bytes
Input Output
36
Interface
SPI/I2C/USART
Memory Type
Flash
Number Of Bits
8
Package Type
44-pin TQFP
Programmable Memory
64K Bytes
Ram Size
4K Bytes
Speed
40 MHz
Timers
1-8 bit, 3-16 bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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Part Number:
PIC18F4620-I/PT
Manufacturer:
Microchip Technology
Quantity:
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Part Number:
PIC18F4620-I/PT
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0
PIC18F2525/2620/4525/4620
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 105
11.0 Timer0 Module ......................................................................................................................................................................... 123
12.0 Timer1 Module ......................................................................................................................................................................... 127
13.0 Timer2 Module ......................................................................................................................................................................... 133
14.0 Timer3 Module ......................................................................................................................................................................... 135
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 139
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 147
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 161
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 201
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 223
20.0 Comparator Module.................................................................................................................................................................. 233
21.0 Comparator Voltage Reference Module ................................................................................................................................... 239
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 243
23.0 Special Features of the CPU .................................................................................................................................................... 249
24.0 Instruction Set Summary .......................................................................................................................................................... 267
25.0 Development Support............................................................................................................................................................... 317
26.0 Electrical Characteristics .......................................................................................................................................................... 323
27.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 361
28.0 Packaging Information.............................................................................................................................................................. 363
Appendix A: Revision History............................................................................................................................................................. 371
Appendix B: Device Differences......................................................................................................................................................... 371
Appendix C: Conversion Considerations ........................................................................................................................................... 372
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 372
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 373
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 373
Index .................................................................................................................................................................................................. 375
On-Line Support................................................................................................................................................................................. 385
Systems Information and Upgrade Hot Line ...................................................................................................................................... 385
Reader Response .............................................................................................................................................................................. 386
PIC18F2525/2620/4525/4620 Product Identification System ............................................................................................................ 387
DS39626B-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 53
Flash Program Memory .............................................................................................................................................................. 73
Data EEPROM Memory ............................................................................................................................................................. 83
8 x 8 Hardware Multiplier............................................................................................................................................................ 89
Interrupts .................................................................................................................................................................................... 91
Preliminary
 2004 Microchip Technology Inc.

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