MT29F1G08ABBDAH4-IT:D Micron Technology Inc, MT29F1G08ABBDAH4-IT:D Datasheet - Page 14

• Manufacturer Part Number: MT29F1G08ABBDAH4-IT:D
• Manufacturer: Micron Technology Inc

Specifications of MT29F1G08ABBDAH4-IT:D

• Cell Type: NAND
• Density: 8Gb
• Interface Type: Parallel
• Address Bus: 27b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: VFBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 1.95V
• Word Size: 8b
• Number Of Words: 128M
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 63
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Figure 7: 63-Ball VFBGA (H4) 9mm x 11mm
PDF: 09005aef83e5ffed
m68a.pdf – Rev. D 06/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.4 SMD
ball pads.
Seating
plane
63X Ø0.45
0.12 A
8.8 CTR
0.8 TYP
Note:
A
10 9
1. All dimensions are in millimeters.
8
7
7.2 CTR
9 ±0.1
6
0.8 TYP
5
4
3
2
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
L
M
14
11 ±0.1
Ball A1 ID
Bottom side saw fiducials may or
may not be covered with soldermask.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb x8, x16: NAND Flash Memory
0.25 MIN
1.0 MAX
Package Dimensions
© 2010 Micron Technology, Inc. All rights reserved.
Ball A1 ID