GP2W0004YP Sharp Microelectronics, GP2W0004YP Datasheet - Page 9

• Manufacturer Part Number: GP2W0004YP
• Description: IRDA MODULE 115.2KBPS 6SMD
• Manufacturer: Sharp Microelectronics

Specifications of GP2W0004YP

• Data Rate: 115.2kbs (SIR)
• Idle Current, Typ @ 25° C: 1µA
• Link Range, Low Power: 20cm
• Operating Temperature: -25°C ~ 85°C
• Orientation: Side View
• Shutdown: *
• Size: 9.21mm x 3.86mm x 2.71mm
• Standards: -
• Supply Voltage: 2.4 V ~ 5.5 V
• Lead Free Status / Rohs Status: Contains lead / RoHS non-compliant
• Other names: 425-1170-2

Infrared Transceiver
Soldering Reflow Profile
ommended temperature profile for the IR solder reflow
process. The temperature profile is divided into four
process sections with three temperature/time change
rates. The temperature/time details are described in
Table 3.
GP2W0004YP molded pinout joints are heated to a
temperature of 165°C to activate the flux in the solder
paste. The temperature ramp-up rate R1 should be
within the range of 1°C to 5°C per second. Package
temperature must be kept within the temperature range
specified in order to avoid localized temperature rise in
the resin.
paste should be provided, a maximum of 120 seconds
is recommended for optimum results. A stable temper-
ature is recommended with little temperature increase,
preferably staying at the level of 165°C.
IrDA Technical Information
Figure 15 is a straight-line representation of the rec-
I n p r o c e s s s e c t i o n 1 , t h e P C B a n d S M D
In process section 2, sufficient time to dry the solder
1. Heat Up
2. Solder Paste Dry
3. Solder Reflow
4. Cooling
PROCESS SECTION
TEMPERATURE
Table 3. Process Section Information
165°C - 240°C
~165°C
~200°C
165°C
SYMBOL
should be raised to 240°C for 10 seconds, at the rate of
1°C to 4°C per second (R2) for the desired result. The
dwell time above 200°C must not exceed 60 seconds.
Beyond 60 seconds, weak and unreliable connections
will result.
temperature should then be reduced at the rate of -1°C
to -4°C per second (R3). Please note that deformation
of the PCB can also affect the pins of the package,
which may break the gold wire used in the transceiver
module. Full confirmation of the soldering reflow
machine condition is highly recommended for optimal
results.
iron of less than 25 W, at less than 300°C. Soldering
time is less than 5 seconds per contact, with a second
or two between soldering each contact. The device
being soldered by hand should be at room temperature.
Use 60/40 or 63/37 solder, or Ag solder if it is available.
Process section 3 is solder reflow. The temperature
Process section 4 is cooling. After solder reflow, the
Hand soldering should be conducted with a soldering
R1
R2
R3
TERMPERATURE/TIME MAX.
-1°C - 4°C/sec. MAX.
1°C - 5°C/sec. MAX.
1°C - 5°C/sec. MAX.
GP2W0004YP/XP
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