NLAS4684MNR2G ON Semiconductor, NLAS4684MNR2G Datasheet - Page 13

• Manufacturer Part Number: NLAS4684MNR2G
• Description: IC SWITCH DUAL SPDT 10DFN
• Manufacturer: ON Semiconductor

Specifications of NLAS4684MNR2G

• Function: Switch
• Circuit: 2 x SPDT
• On-state Resistance: 800 mOhm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Current - Supply: 200nA
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NLAS4684MNR2GOS; NLAS4684MNR2GOS; NLAS4684MNR2GOSTR

10X
2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
10X
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
A
DFN10, 3 x 3mm, 0.5mm Pitch
PACKAGE DIMENSIONS
C
SEATING
PLANE
http://onsemi.com
L1
MOLD CMPD
CASE 485C−01
ISSUE A
Bottom View
A1
(Optional)
DETAIL A
13
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
É É É É
É É
(Optional)
DETAIL B
Side View
EDGE OF PACKAGE
0.5651
10X
2.1746
0.3008
EXPOSED Cu
10X
SOLDERING FOOTPRINT*
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
2.6016
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
b
D
E
e
K
L
MILLIMETERS
MIN
0.80
0.00
0.18
2.45
1.75
0.35
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
DIMENSIONS: MILLIMETERS
MAX
1.00
0.05
0.30
2.55
1.85
0.45
0.03
0.5000 PITCH
1.8508
3.3048