CY7C1382C-200AC Cypress Semiconductor Corp, CY7C1382C-200AC Datasheet - Page 23

• Manufacturer Part Number: CY7C1382C-200AC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1382C-200AC

• Density: 18Mb
• Access Time (max): 3ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 200MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 20b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 1
• Supply Current: 300mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.465V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 18b
• Number Of Words: 1M
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05237 Rev. *D
165-Ball fBGA Boundary Scan Order
BIT#
10
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
11
0
1
2
3
4
5
6
7
8
9
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
BALL ID
M10
B10
A10
C11
D11
G11
H11
K10
R11
R10
P10
A11
E11
F11
J10
L10
P11
B6
B7
A7
B8
A8
B9
A9
R9
R8
P9
P8
CY7C1382C (1M x 18)
BIT#
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
Not Bonded (Preset to 0)
BALL ID
Internal
M1
N6
R6
P6
R4
R3
P4
P3
R1
N1
K1
G2
E2
D2
A2
B2
A3
B3
A4
B5
A6
L1
F2
J1
CY7C1380C
CY7C1382C
Page 23 of 36
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