TEA1095TS NXP Semiconductors, TEA1095TS Datasheet - Page 20
TEA1095TS
Manufacturer Part Number
TEA1095TS
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TEA1095TS.pdf
(28 pages)
Specifications of TEA1095TS
Operating Temp Range
-25C to 75C
Package Type
SSOP
Pin Count
24
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TEA1095TS
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
PACKAGE OUTLINES
1997 Nov 25
DIP24: plastic dual in-line package; 24 leads (600 mil)
Voice switched speakerphone IC
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
VERSION
SOT101-1
OUTLINE
L
max.
0.20
5.1
A
Z
24
1
0.020
min.
0.51
A
1
pin 1 index
051G02
IEC
max.
0.16
4.0
A
2
0.066
0.051
1.7
1.3
b
e
MO-015AD
D
0.021
0.015
0.53
0.38
JEDEC
b
1
REFERENCES
0.013
0.009
0.32
0.23
c
0
b
32.0
31.4
1.26
1.24
D
(1)
scale
EIAJ
20
5
13
b
12
14.1
13.7
0.56
0.54
1
E
(1)
A
10 mm
1
w
2.54
0.10
M
e
A
E
2
A
15.24
0.60
e
1
0.15
0.13
3.9
3.4
L
c
PROJECTION
EUROPEAN
15.80
15.24
0.62
0.60
M
E
(e )
M
M
1
H
E
17.15
15.90
0.68
0.63
M
Product specification
H
TEA1095
ISSUE DATE
0.25
0.01
92-11-17
95-01-23
w
SOT101-1
max.
0.087
2.2
Z
(1)