TEA1095TS NXP Semiconductors, TEA1095TS Datasheet - Page 20

• Manufacturer Part Number: TEA1095TS
• Manufacturer: NXP Semiconductors

Specifications of TEA1095TS

• Operating Temp Range: -25C to 75C
• Package Type: SSOP
• Pin Count: 24
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
PACKAGE OUTLINES
1997 Nov 25
DIP24: plastic dual in-line package; 24 leads (600 mil)
Voice switched speakerphone IC
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
VERSION
SOT101-1
OUTLINE
L
max.
0.20
5.1
A
Z
24
1
0.020
min.
0.51
A
1
pin 1 index
051G02
IEC
max.
0.16
4.0
A
2
0.066
0.051
1.7
1.3
b
e
MO-015AD
D
0.021
0.015
0.53
0.38
JEDEC
b
1
REFERENCES
0.013
0.009
0.32
0.23
c
0
b
32.0
31.4
1.26
1.24
D
(1)
scale
EIAJ
20
5
13
b
12
14.1
13.7
0.56
0.54
1
E
(1)
A
10 mm
1
w
2.54
0.10
M
e
A
E
2
A
15.24
0.60
e
1
0.15
0.13
3.9
3.4
L
c
PROJECTION
EUROPEAN
15.80
15.24
0.62
0.60
M
E
(e )
M
M
1
H
E
17.15
15.90
0.68
0.63
M
Product specification
H
TEA1095
ISSUE DATE
0.25
0.01
92-11-17
95-01-23
w
SOT101-1
max.
0.087
2.2
Z
(1)