S29GL064A10TFIR43 Spansion Inc., S29GL064A10TFIR43 Datasheet - Page 20

• Manufacturer Part Number: S29GL064A10TFIR43
• Manufacturer: Spansion Inc.

Specifications of S29GL064A10TFIR43

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 100ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

6.2
20
S29GL032A Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S29GL032A
S29GL032A
Number
Device
90, 10, 11
Device Number/Description
S29GL032A
32 Megabit Page-Mode Flash Memory Manufactured using 200 nm MirrorBit
Option
Speed
10, 11
90
S29GL032A Valid Combinations
Program, and Erase
T
Package, Material,
& Temperature
A
BAI,BFI
BAI,BFI
FAI,FFI
FAI,FFI
Range
TAI,TFI
TAI,TFI
I
R1
Table 6.2 S29GL032A Ordering Options
0
Number
Packing Type
0 = Tray
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
Model Number
R1 = x8/x16, V
R2 = x8/x16, V
R3 = x8/x16, V
R4 = x8/x16, V
W3= x16, V
W4= x16, V
Temperature Range
I
Package Material Set
A = Standard
F = Pb-Free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F = Fortified Ball-Grid Array Package
Speed Option
See
W3,W4
R1, R2
Model
R3,R4
S29GL-A
*W3 and W4 are MCP-compatible packages for cellular handsets only
= Industrial (–40°C to +85°C)
Product Selector Guide on page 9
when WP#/ACC=V
when WP#/ACC=V
protected when WP#/ACC=V
protected when WP#/ACC=V
D a t a
(Note 1)
Packin
CC
CC
Type
0,2,3
=2.7 – 3.6 V, 56-ball FBGA, top boot sector device *
=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device*
g
CC
CC
CC
CC
=3.0 – 3.6 V, Uniform sector device, highest address sector protected
=3.0 – 3.6 V, Uniform sector device, lowest address sector protected
=3.0 – 3.6 V, Top boot sector device, top two address sectors
=3.0 – 3.6 V, Bottom boot sector device, bottom two address sectors
S h e e t
TS056
LAA064
TS048
VBK048
LAA064
VBU056
IL
IL
(Note 2)
(Note 2)
(Note 3)
(Note 3)
(Note 3)
(Note 3)
IL
IL
and Valid Combinations below
®
Process Technology, 3.0 Volt-only Read,
TSOP
Fortified BGA
TSOP
Fine-Pitch BGA
Fortified BGA
Fine-Pitch BGA (For cellular handsets only)
Package Description
S29GL-A_00_A12 May 21, 2008
(Notes)