ADG918BRM-500RL7 Analog Devices Inc, ADG918BRM-500RL7 Datasheet - Page 15

• Manufacturer Part Number: ADG918BRM-500RL7
• Manufacturer: Analog Devices Inc

Specifications of ADG918BRM-500RL7

• Frequency (max): 2GHz
• Insertion Loss (max): 1.25dB
• Pin Count: 8
• Package Type: MSOP
• Lead Free Status / Rohs Status: Not Compliant

OUTLINE DIMENSIONS
SEATING
0.90 MAX
0.85 NOM
0.95
0.85
0.75
PLANE
INDICATOR
0.15
0.00
COPLANARITY
PIN 1
3.20
3.00
2.80
PIN 1
Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
12° MAX
0.10
Figure 30. 8-Lead Mini Small Outline Package [MSOP]
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.38
0.22
8
1
0.65 BSC
3.25
3.00 SQ
2.75
VIEW
TOP
3.20
3.00
2.80
3 mm x 3 mm Body, Very Thin, Dual Lead
0.30
0.23
0.18
0.70 MAX
0.65 TYP
Dimensions shown in millimeters
Dimensions shown in millimeters
5
4
SEATING
PLANE
2.95
2.75 SQ
2.55
0.20 REF
Rev. C | Page 15 of 16
5.15
4.90
4.65
0.05 MAX
0.01 NOM
1.10 MAX
0.60 MAX
(CP-8-2)
(RM-8)
0.50
0.40
0.30
0.23
0.08
0.60 MAX
EXPOSED PAD IS CONNECTED INTERNAL LY.
FOR INCREASED RELIABILIT Y OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE GROUND PLANE.
5
4
(BOTTOM VIEW)
EXPOSED
PAD
1
8
8°
0°
1.89
1.74
1.59
0.50
BSC
PIN 1
INDICATOR
1.60
1.45
1.30
0.80
0.60
0.40
ADG918/ADG919