BF996ST NXP Semiconductors, BF996ST Datasheet - Page 3

BF996ST

Manufacturer Part Number
BF996ST
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BF996ST

Application
UHF
Channel Type
N
Channel Mode
Depletion
Continuous Drain Current
0.03A
Drain Source Voltage (max)
20V
Power Gain (typ)@vds
25@15VdB
Noise Figure (max)
1.8(Typ)dB
Package Type
SOT
Pin Count
3 +Tab
Input Capacitance (typ)@vds
2.3@15V@Gate 1/1.2@15V@Gate 2pF
Output Capacitance (typ)@vds
0.8@15VpF
Reverse Capacitance (typ)
0.025@15VpF
Operating Temp Range
-65C to 150C
Mounting
Surface Mount
Number Of Elements
1
Power Dissipation (max)
200mW
Screening Level
Military
Lead Free Status / Rohs Status
Compliant
NXP Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
Note to the Limiting values and the Thermal characteristics
1. Device mounted on a ceramic substrate of 8  10  0.7 mm.
April 1991
handbook, halfpage
V
I
I
I
I
P
T
T
R
SYMBOL
SYMBOL
D
D(AV)
G1-S
G1-S
stg
j
DS
tot
N-channel dual-gate MOS-FET
th j-a
(mW)
P tot
200
100
0
0
drain-source voltage
drain current (DC)
average drain current
gate 1 source
gate 2 source
total power dissipation
storage temperature range
junction temperature
thermal resistance from junction to ambient
Fig.2 Power derating curve.
PARAMETER
PARAMETER
100
T amb (°C)
MGE792
200
up to T
in free air; note 1
amb
3
CONDITIONS
= 60 C; note 1
CONDITIONS
65
MIN.
VALUE
460
Product specification
20
30
30
10
10
200
+150
150
MAX.
BF996S
UNIT
K/W
V
mA
mA
mA
mA
mW
C
C
UNIT

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