IBM25PPC750FL-GR0133T IBM MICROELECTRONICS, IBM25PPC750FL-GR0133T Datasheet - Page 49

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IBM25PPC750FL-GR0133T

Manufacturer Part Number
IBM25PPC750FL-GR0133T
Description
MPU 750xx RISC 32-Bit 0.13um 600MHz 1.8V/2.5V/3.3V 750-Pin CBGA Tray
Manufacturer
IBM MICROELECTRONICS
Datasheet

Specifications of IBM25PPC750FL-GR0133T

Package
750CBGA
Device Core
PowerPC
Family Name
750xx
Number Of Cpu Cores
1
Data Bus Width
32 Bit
Maximum Speed
600 MHz
I/o Voltage
1.8|2.5|3.3 V
Operating Temperature
-40 to 105 °C
Preliminary
5.4 Output Buffer dc Impedance
The 750FL 60x drivers were characterized over various process, voltage, and temperature conditions. To
measure Z
resistor is varied until the pad voltage is OV
The output impedance is actually the average of two resistances: the resistance of the pull-up and the resis-
tance of pull-down devices. When Data is held low, SW1 is closed (SW2 is open), and R
Pad = OV
closed (SW1 is open), and R
devices. With a properly designed driver R
Figure 5-6. Driver Impedance Measurement
750flds60.fm.6.0
April 27, 2007
DD
0
, an external resistor is connected to the chip pad, either to OV
/2. R
N
then becomes the resistance of the pull-down devices. When Data is held high, SW2 is
Data
P
is trimmed until Pad = OV
P
DD
and R
/2 (see Figure 5-6).
N
are close to each other in value, then Z
DD
/2. R
Pad
R
R
P
P
N
then becomes the resistance of the pull-up
OV
GND
PowerPC 750FL RISC Microprocessor
DD
DD
SW2
SW1
or GND. Then the value of such
System Design Information
N
is trimmed until
0
= (R
Page 49 of 65
P
+ R
N
)/2.

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