XE056LCC-1 Cermetek Microelectronics, XE056LCC-1 Datasheet - Page 6

• Manufacturer Part Number: XE056LCC-1
• Manufacturer: Cermetek Microelectronics

Specifications of XE056LCC-1

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Because of its Hybrid construction, the XE056LCC DAA is subject to damage if over exposed to heat
during solder reflow operations. Following the soldering instructions below will ensure that the process
of soldering the module to the board does not damage the DAA.
Notes:
Do not expose the XE056LCC DAA module to direct Infrared (IR) heating. If your process includes
direct IR heating, you must shield the DAA module from the infrared radiation.
Xecom’s XE056LCC DAA modules should be exposed to no more than one reflow cycle.
Slim-Link
235
217
150
Cermetek
O
O
O
C
C
C
------------------------------180 sec max-------------------------
®
Maximum Recommended Solder Temperature Profile
Maximum Time in reflow zone (217
PLCC Soldering Instructions
Absolute Maximum Temperature
Maximum Preheat Dwell Time
Maximum Time at 235
(6)
O
O
C)
C
250
90 Seconds
15 Seconds
180 Seconds
------- 90 sec max ------
O
C
-15 sec-
max
XE056LCC