SAM7XC256 Atmel Corporation, SAM7XC256 Datasheet - Page 78

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SAM7XC256

Manufacturer Part Number
SAM7XC256
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM7XC256

Flash (kbytes)
256 Kbytes
Pin Count
100
Max. Operating Frequency
55 MHz
Cpu
ARM7TDMI
Hardware Qtouch Acquisition
No
Max I/o Pins
62
Ext Interrupts
62
Usb Transceiver
1
Usb Speed
Full Speed
Usb Interface
Device
Spi
2
Twi (i2c)
1
Uart
3
Can
1
Ssc
1
Ethernet
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
384
Resistive Touch Screen
No
Dac Resolution (bits)
No
Temp. Sensor
No
Crypto Engine
AES/DES
Sram (kbytes)
64
Self Program Memory
NO
Dram Memory
No
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
3.3
Operating Voltage (vcc)
3.0 to 3.6
Fpu
No
Mpu / Mmu
no / no
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
Memory Interface
3.3.4
3-8
Merged IS cycles
Where possible the ARM7TDMI processor broadcasts the address for the next access,
so that decode can start, but the memory controller must not commit to a memory
access. This is shown in Figure 3-4 and, is further described in Nonsequential memory
cycle on page 3-6.
Where possible, the ARM7TDMI processor performs an optimization on the bus to
allow extra time for memory decode. When this happens, the address of the next
memory cycle is broadcast on this bus during an internal cycle. This enables the
memory controller to decode the address, but it must not initiate a memory access
during this cycle. In a merged IS cycle, the next cycle is a sequential cycle to the same
memory location. This commits to the access, and the memory controller must initiate
the memory access. This is shown in Figure 3-5 on page 3-9.
Copyright © 1994-2001. All rights reserved.
nMREQ
D[31:0]
A[31:0]
MCLK
nRAS
nCAS
SEQ
N-cycle
a
a+4
S-cycle
Figure 3-4 Internal cycles
a+8
I-cycle
ARM DDI 0029G
a+12
C-cycle

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