AD7707 Analog Devices, AD7707 Datasheet - Page 50

• Manufacturer Part Number: AD7707
• Manufacturer: Analog Devices

Specifications of AD7707

• Resolution (bits): 16bit
• # Chan: 3
• Sample Rate: n/a
• Interface: Ser,SPI
• Analog Input Type: Diff-Uni,SE-Bip
• Ain Range: Bip (Vref)/(PGA Gain),Bip 10V,Bip 5.0V,Uni (Vref)/(PGA Gain),Uni 10V,Uni 5.0V
• Adc Architecture: Sigma-Delta
• Pkg Type: SOIC,SOP

AD7707
ORDERING GUIDE
Model
AD7707BR
AD7707BR-REEL
AD7707BRZ
AD7707BRZ-REEL
AD7707BRZ-REEL7
AD7707BRU
AD7707BRU-REEL7
AD7707BRUZ
AD7707BRUZ-REEL
AD7707BRUZ-REEL7
1
Z = RoHS Compliant Part.
1
V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
DD
Supply
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Rev. B | Page 50 of 52
Package Description
20-Lead Standard Small Outline Package [SOIC_W]
20-Lead Standard Small Outline Package [SOIC_W]
20-Lead Standard Small Outline Package [SOIC_W]
20-Lead Standard Small Outline Package [SOIC_W]
20-Lead Standard Small Outline Package [SOIC_W]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
Package Option
RW-20
RW-20
RW-20
RW-20
RW-20
RU-20
RU-20
RU-20
RU-20
RU-20