PMEG3020BEP NXP Semiconductors, PMEG3020BEP Datasheet - Page 3

• Manufacturer Part Number: PMEG3020BEP
• Description: Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD128 small and flat leadSurface-Mounted Device (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Thermal characteristics
PMEG3020BEP_1
Product data sheet
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
Table 6.
[1]
[2]
[3]
[4]
[5]
[6]
Symbol
T
T
T
Symbol
R
R
j
amb
stg
th(j-a)
th(j-sp)
Device mounted on a ceramic PCB, Al
T
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses P
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Device mounted on a ceramic PCB, Al
Soldering point of cathode tab.
j
= 25 C prior to surge.
Limiting values
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Parameter
junction temperature
ambient temperature
storage temperature
R
are a significant part of the total power losses.
Rev. 01 — 16 October 2009
…continued
2
2
O
O
3
3
, standard footprint.
, standard footprint.
Conditions
in free air
Conditions
2 A low V
F
MEGA Schottky barrier rectifier
PMEG3020BEP
[1][2]
[3]
[4]
[5]
[6]
Min
-
Min
-
-
-
-
55
65
Typ
-
-
-
-
© NXP B.V. 2009. All rights reserved.
Max
150
+150
+150
Max
200
120
60
12
Unit
2
2
C
C
C
.
.
Unit
K/W
K/W
K/W
K/W
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