ST7260E1 STMicroelectronics, ST7260E1 Datasheet - Page 130

• Manufacturer Part Number: ST7260E1
• Description: LOW SPEED USB 8-BIT MCU FAMILY WITH UP TO 8K FLASH/ROM AND SERIAL COMMUNICATION INTERFACE (SCI)
• Manufacturer: STMicroelectronics

Specifications of ST7260E1

• 4 Or 8 Kbytes Program Memory: high density Flash (HDFlash), or FastROM with readout and write protection

Package characteristics
17.1.1
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Thermal characteristics
Table 76.
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
of an application can be defined by the user with the formula: P
internal power (I
application.
Symbol
T
R
P
Jmax
thJA
D
Package thermal characteristics
DD
xV
Package thermal resistance (junction to
ambient)
Power dissipation
Maximum junction temperature
DD
) and P
PORT
is the port power dissipation depending on the ports used in the
(1)
Ratings
(2)
D
D
=PI
= (T
QFN40
SO24
NT
J
+P
-T
A
PORT
) / R
thJA
where P
. The power dissipation
Value
500
150
70
34
INT
is the chip
ST7260xx
°C/W
Unit
mW
°C